The New Technologies Of TSMC's Three Major Chips Are Released. Can We Cross The Technology Gap And Lead The Future?

        on the stage of the semiconductor industry, TSMC is undoubtedly a bright star.As the world's leading chip manufacturing plant, TSMC not only maintains its leading position in the world in terms of technology, but its yield and market share are equally crowned.In order to ensure that this domineering status is unwavering, TSMC invested as much as tens of billions of dollars in R & D each year. Such investment scale made other small companies be at no way.

        In recent days, TSMC once again showed its strong R & D strength, released three new technologies in one breath, and continued to lead the trend of global chip technology development.

        First of all, TSMC launched the Optical Power Packaging Technology (CPO).This technology combines optical communication technology with traditional chip technology, and is encapsulated in the same chip to achieve the combination of light and electricity.This innovative design not only improves the speed of data transmission, reduces loss, but also reduces costs, reduces the size, and provides more efficient solutions for artificial intelligence and data center applications.This technology is expected to achieve mass production in 2026, bringing revolutionary changes to the industry.

        second, TSMC is developing back power supply technology.Compared with the traditional frontal power supply technology, the back power supply technology deploys the power supply on the back of the chip, which releases the front space and improves the performance, power efficiency and area utilization of the chip.Against the background of the current chip process is slow and cost -effective, the power supply technology on the back is expected to significantly improve the performance of the chip without changing the process and reduce power consumption.

      In the end, TSMC also launched wafer -level packaging technology.This technology encapsulates a variety of chips on the same wafer to achieve direct interconnection between chips.This design significantly improves the performance of the chip, reduces mutual transmission loss, and increases the area.Although it may not be applicable for small space devices such as mobile phones, this technology will play a huge advantage in data centers and AI servers, such as data centers and AI servers.

        These three technologies are based on the advanced manufacturing and packaging process of TSMC, making it more advantageous in the global competition with giants such as Samsung and Intel.For our domestic chip industry, although it may be difficult to catch up with the pace of accumulation in the short term, we must firmly strengthen our confidence, increase investment in research and development, and strive to master these key technologies to get rid of foreign dependence and achieve autonomous controlling.