GTX312L Is More Advantageous Than TSM12 Smart Door Lock Touch Chip Solution

Korean GreenChip (green core) GTX312L is a 12 -channel capacitor sensor with automatic sensitivity calibration with high sensitivity, super anti -interference capacity,

The power supply voltage range is 1.8V ~ 5.0V, supporting single -key/multi -touch; I2C communication protocol; internal control寄存器You can use the I2C read and write interface.

GTX312L chip can perfectly replace TSM12 PIN to PIN; exceptExcept for registers that have richer content than TSM12Also possessStronger anti -interference performance, Can resist Tesla coil interference,The reaction is more accurate when touching, Will not be affected by external factors.

It has internal power -on reset and external reset function.The internal reset operation is used for initial power -on reset, and the external reset operation is completed by the NRST pin.The low -pulse signal output through the NRST pin is used for sudden reset, and the sudden reset requires dense system reset. The NRST PIN is floating. When the external reset is not used, there is no external reset component.

GTX312L Features:

◆ 12 -channel capacitors with automatic sensitivity calibration

◆嵌入式Unique Greentouch3LP engine algorithm

-It simulation compensation电路

-Embedded digital noise filter

-Smark sensitivity calibration

-The low power enhancer

◆ Support I2C interface

◆ Provide interrupt function

◆ Provide slide mode

◆ Provide the register to write the lock function

◆ Sleep mode current consumption 4.5UA

Most main control chips on the market are generally adoptedMCU, But with MCU, programming is prone to BUG, which causes the touch effect to be unstable, andGTX312L has controlled the program, just need to be accessed, so that the control is more accurate.The internal control register can use the I2C read and write interface; it provides a chip IDI2C bus that can be switched on the same chip for two chips. The main frequency is as high as 108MHz, which can fully meet the computing power requirements of various functional scheduling of smart door locks.

The design suggestions and precautions of the GTX312L chip when making smart lock products will be slightly different according to the different formats. Customers can adjust according to the actual situation.

If the original TSM12 chip is used, the following changes need to be made when replacing GTX312L:

1) It turned out to be on the 15th pin of the TSM12 schematic diagram电阻Replace the capacitance of about 5pf ~ 10pf.

2) The 16th pin of the original TSM12 schematic diagram is suspended.

3) If you want to change the small, you can treat it according to the above 1 and 2 items. If the customer wants to save costs further, you can get all the devices on the other feet, but the 10K pull on the I2C should be kept.

Precautions for hardware design:

1) VDD power supply should be stable. After the battery is passed through LDO, it is recommended to power power. It is recommended not to skeve power with the main control and other chips.

2) The capacitor of the RIN foot hangs around 10PF. The existing customers are mainly available for 6.8pf and 10pf.

3) The chip VDD voltage is consistent with the VDD pulled on the periphery.

4) From the SIN foot of the chip to the short line of the press pad, the wiring is as short as possible. The larger the spacing between the SIN and the SIN line, the better, the less the number of parallel wiring

5) The resistance on the SIN line is close to the chip, and this resistor can also be removed according to the version situation.

6) Do not have land next to and at the bottom of the SIN and RIN lines. The distance between the land and the bottom layer should be kept by 0.5mm or more.Specific consulting technical support staff

7) The larger the spacing of the SIN line and antenna, the better. Whether the SIN line and antennas are on the same layer or different layers, the shorter the distance from the parallel.Try not to overlap as much as possible, it doesn't matter if you overlap a little, but don't overlap completely.

8) Do not take the audio cable under the chip, do not put the crystal volume on the back of the chip and key pads