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China's Advanced Packaging Industry Research Report In 2024第一章 行业概况1.1 简介封装技术是半导体制造过程中的关键环节，旨在保护芯片免受物理和化学损害，同时确保芯片与其他电子元件的有效连接。随着技术的发展，封装技术可以分为传统封装和先进封装两大类，二者在工艺、应用和性能上各有特点。传统封装技术在半导体行业中已有较长的发展历史，其主要特点是性价比高、产品通用性强、使用成本低和应用领域广泛。传统封装工艺通常先将晶圆切割成单个芯片，再进行封装。利用引线框架作为载体，采用引线键合互连的形式进行封装...
Industry Information 2024-05-22 12:43:17 105
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