Affected by storage shortages, price increases, and changes in Nexperia’s supply chain,The pattern of hot search materials has been completely rewritten: The STM32F103C8T6, which has always dominated the list, has been r...

A Morimi semiconductor has announced the acquisition of SensL Technologies Ltd (hereinafter referred to as "SensL"). The acquisition is expected to immediately increase the non GAAP (Non-GAAP) earnings per share of A Morimi semiconductor. SensL, headquartered in Ireland, is a technical leader for the automotive, medical, industrial and consumer markets for silicon photomultiplier (SiPM), single photon avalanche diode (SPAD) and LiDAR (LiDAR) sensing products.

International Consumer Electronics Show CES exhibition on January 9 will be launched in Las Vegas, Taiwan digital imaging program expert Hua Jingke will be released at the CES show the latest 3D sensing depth chip AL6100, hoping to borrow by The world's largest science and technology exhibition so that the world see Huajing Branch of the technical strength and products.

iPhone X to give up fingerprinting Face ID gradually gaining market acceptance, so that non-Apple camp phone factory also accelerated layout, according to vendor vendors revealed that Huawei, OPPO, millet and other brand manufacturers have embraced 3D sensor technology. It is foreseeable that with the 3D sensing technology market continues to open, 2018 will launch a new machine with 3D sensor capabilities will spring up, the fingerprint recognition application under the screen may face crowding-out effect.