[Core Information] Semiconductor industry quick report in early May 2025 (5.7-5.9)

1. SMIC: Q1 performance explodes, mature process dividends released

• Core Finance (Q1 2025)
  • Revenue:$2.247 billion，Year-on-year + 28.4%, month-on-month +1.8%
  • Gross profit margin:22.5%，+8.8 percentage points year-on-year
  • Net profit:$188 million，Year-on-year + 161.9%, month-on-month + 74.8%
  • Capacity:12 inches accounted for 78.1%, capacity utilization rate89.6%
• business structure
  • Consumer electronics accounts for the highest proportion (40.6%),** Industrial and Automobile (9.6%)** The proportion continues to increase
• Performance Outlook
  • Q2: RevenueMonth-on-month - 4%~-6%, gross profit margin18%~20%
  • Second half of the year:Opportunities and challenges coexist, external risks intensify, focus on mature processes and automotive-grade products

2. Storage market: SK Hynix takes the lead in raising prices, establishing an industry turning point

• SK hynix：Consumer grade DRAM particlesPrice increase of about 12%, the contract price officially landed
• Market linkage: SanDisk NAND flash memory from AprilPrice increase over 10%
• Main reason for price increase
  • supply contraction: The three major manufacturers have collectively reduced production, and DRAM production capacity is tilted towards **HBM (High Bandwidth Memory)**
  • demand burst: Demand for AI server HBM/DDR5 surges,American customers hoard goods to avoid risks
  • rising costs: Raw materials and wafer foundry prices rise, and tariff costs are passed on

3. Trends of major international manufacturers

1. Infineon: €5 billion Dresden plant approved

• investment5 billion eurosA new 12-inch power semiconductor plant received final approval from the German government
• Main attackAutomotive, Renewable Energy, Data Centerchip,Start production in 2026, creating 1,000 new jobs
• Strengthen European supply chain security and consolidate Europe’s position as the semiconductor center
  

2. NXP: Released third-generation radar processor S32R47

• 16nm FinFETcraftsmanship,Double the processing power, chip volume38% smaller
• IntegrateAI/MLengine, support4D imaging radar, accurately identify pedestrians and obstacles
• reduce89% Antenna ChannelTo achieve the same performance,Reduce costs and increase efficiency, adapted to L2+~L4 autonomous driving
  

3. Intel: 18A process achieved major breakthrough

• MicrosoftOfficially placed an order for 18A process chip (Azure AI chip)
• AmazonUsing 18A to produce AWS AI Fabric chips
• Positive andNVIDIA, GoogleNegotiate OEM cooperation,Benchmarking TSMC 2nm
• Core advantages:RibbonFET+PowerViaTechnology, performance + 25%, power consumption - 36%
  

  

4. Domestic manufacturers: Car specifications, power, and safety chips are all working together

1. Jiejie Microelectronics: Automotive packaging and testing production capacity ramps up

• The car-grade sealing and testing project will be put into trial production in January.1.4 billion new ones by 2025Packaging capacity
• Products: DFN/TOLL/LFPACK/WCSP, etc.Automotive-grade high-power devices
• Goal: after deliveryAnnual sales of 2 billion yuan, covering new energy vehicle electric drive and battery systems

2. China Micro Semiconductor: Motor chips are used in humanoid robots

• Brushless motor driver chipHigh business growth,Used in batches for robot joints
• Already enteredhumanoid robotSupply chain, adapted to high-precision servo control
• Application extension: home appliances, power tools, industrial automation

3. National Core Technology: Anti-quantum cryptographic chip test successful

• AHC001The chip is based onDomestic 28nm、Autonomous CPU core
• supportML-KEM/ML-DSAetc. NIST Standard Quantum Resistant Algorithms
• Low power consumption (static0.13mW), adapted to high-security scenarios in finance, communications, and the Internet of Things

5. Industry Summary and Key Trends

1. recovery differentiation：AI / Automotive ElectronicsHigh prosperity (TSMC, SMIC, Infineon);consumer electronicsmild recovery
2. storage inversion：Production reduction + AI demandpushDRAM/NANDPrices rise and the industry enters an upward cycle
3. technology competition:Intel18ABreakout, TSMCN2Leading, competition for advanced processes intensifies
4. Domestic breakthrough：Automotive power devices, quantum-resistant security chipshas become the focus of substitution, and local manufacturers are accelerating their volume expansion