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WsxMall > Industry Information > [Core Information] Semiconductor Industry Quick Report In Late April 2025 (4.28-4.30)

[Core Information] Semiconductor Industry Quick Report In Late April 2025 (4.28-4.30)

[Core Information] Semiconductor industry quick report in late April 2025 (4.28-4.30)

core main lineAuto chip demand slowsDragging down major international manufacturers (NXP, Samsung),Domestic replacementAccelerate breakthroughs in automotive SerDes and RF front-end (L-PAMiD),Panel driver ICThe price decline has slowed down, and the industry hasstructural differentiation

1. NXP: Q1 revenue fell 9%, the automotive business was weak, and the coach was changed at the end of the year

  • Core Finance (2025 Q1)
    • Revenue:$2.835 billionYear-on-year - 9%, month-on-month - 9%
    • Gross profit margin:55%, year-on-year - 2pct, month-on-month - 1.1pct
    • Net profit:$490 millionYear-on-year - 23%, month-on-month - 1%
    • Inventory days:169 days, year-on-year + 25 days, month-on-month + 18 days (all-time high)
  • Business dismantling (overall decline)
    1. Automotive Business (Core): US$1.674 billion,Year-on-year - 7%, month-on-month - 6%(accounting for 59%), affected by the destocking of OEMs and the slowdown in demand for electric vehicles
    2. Industrial and IoT: $508 million,Year-on-year - 11%, month-on-month - 2%
    3. Mobile business: $338 million,Year-on-year - 3%, month-on-month - 15%
    4. Communications infrastructure: $315 million,Year-on-year - 21%, month-on-month - 23%(biggest decline)
  • Management and Outlook
    • CEO Kurt Sievers to retire at the end of the year, Rafael Sotomayor takes over
    • Q2 Guidance: RevenueUS$2.8-3 billion, year-on-year **-10%~-4%**, pressure continues
    • Main reason:Weak global demand, high inventories, tariff uncertaintytriple whammy

2. Policies and domestic breakthroughs: Vehicle regulations and standards are accelerating, SerDes welcomes heavy domestic replacement

1. Ministry of Industry and Information Technology: Accelerate the formulation and revision of automotive chip standards

  • Focus on promoting:Automotive chip reliability, information security, power drive, smart cockpit computing chipStandard formulation and approval
  • Meaning:Standardizing the certification system for domestic automotive chips, lowering entry barriers and accelerating the replacement of overseas chips

2. Nanochip: Releases nationally produced automotive video SerDes chipset

  • Products:Single channel serializerNLS9116, four-channel deserializerNLS9246
    image
  • Core advantages (domestic milestones)
    • National supply chain: Design/manufacturing/packaging and testing are 100% localized to avoid geopolitical risks
    • HSMT public protocol: Break the TI/ADI private agreement monopoly and support cross-vendor mixed procurement
    • Performance Benchmarking International: Receiver tolerance **+100%**, 8kV ESD, EMC benchmark first-class
    • Innovation Dimension Testing: Built-in connector instantaneous monitoring, TDR cable diagnosis (accuracy within 1 meter < 30cm)
  • market:L2+/L3 bicycle accessories8-16 pieces, more high-end cars,There is huge room for domestic substitution

3. Samsung: Chip profits plummeted 42%, HBM was affected by export controls

  • Group financial report (Q1)
    • Total revenue:79.1 trillion won(approximately $58.5 billion),YoY + 10%(all-time high)
    • Operating profit: 6.7 trillion won,Year-on-year + 1.5%
  • Chip (DS) department (crotch pulling)
    • Revenue: 25.1 trillion won;Operating profit 1.1 trillion won, year-on-year - 42%
    • Main reason:Memory chip average price fallsHBM sales decline due to U.S. export controls;Customers are waiting for HBM3E to postpone orders.
  • Complete machine (DX) department: Revenue 51.7 trillion won, profit 4.7 trillion won,Strong performance

4. UMC/Intel/Zhuosheng Micro: Advanced technology and RF front-end breakthroughs

1. UMC × Intel: 12nm cooperation is smooth, mass production in 2027

  • 12nm process: PPA is significantly better than 14nm,Verification in 2026, mass production in 2027
  • Advanced packaging: 3D W2W hybrid bonding,Mass production within the year(RF devices)

2. Zhuoshengwei: Nationwide production of L-PAMiD will begin in the second half of the year

  • Products:The first in the industryNational supply chainL-PAMiD (integrated self-developed MAX-SAW filter)
  • progress:Already inAll brand customer verification/import, some small batch delivery
  • OutlookVolume will start in the second half of 2025, the income contribution is limited this year and will explode next year
  • meaning: Breaking the Skyworks/Qorvo monopoly,High-end RF domestic replacement milestone

5. Qorvo/panel driver IC: RF is stable, DDIC decline is slowing down

1. Qorvo: Revenue fell but gross profit margin increased

  • Revenue $916 million (-7.6% year-over-year), gross margin42.2% (YoY + 1.6pct), profit improvement
  • Strategy: Focus on big customers and promoteRF/power business diversification

2. Panel driver IC (DDIC): price decline converges

  • Q1: average priceQuarterly decrease of 1%-3%;Q2:Slight decline, limited range
  • Second half of the year:It is expected to stop falling and remain stable
  • Main reason:Inventories are healthy and demand is picking up;but subject toGold price, wafer cost, tariffsThree major variable disturbances

6. Industry Summary and Key Trends

  1. Automotive chip cycle turning point: NXP and Samsung’s automotive business declined,Industry destocking deepens, short-term pressure
  2. Domestic alternative golden period:** Vehicle-mounted SerDes (Nanocore Micro), radio frequency L-PAMiD (Zhuosheng Micro)** Achieve key breakthroughs
  3. Cost and price game: DDIC’s decline has slowed down,Rising upstream costsIt may drive price increases in the second half of the year
  4. Technology and Supply Chain: UMC × Intel 12nm advancement,Mature processStill the main battlefield for domestic products


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