[Core News] ON Semiconductor invested heavily to expand production after layoffs, and the Czech Republic built a new vertically integrated silicon carbide production line
1. ON Semiconductor invests US$2 billion in the Czech Republic to build a vertically integrated SiC factory
ON Semiconductor officially announced that it will invest in construction in the Czech Republic
Leading vertically integrated silicon carbide (SiC) manufacturing base, with a total investment of up to
$2 billion, adopting a brownfield expansion model, relying on the existing local basic production capacity of silicon crystal growth, silicon/silicon carbide wafer manufacturing, and slicing processing to upgrade and expand capacity.
The new factory focuses on smart power semiconductors, focusing on
New energy vehicles, renewable energy, AI data centerThe demand for high-energy-efficiency power devices continues to strengthen ON Semiconductor’s full industry chain layout and production capacity say in the SiC track.
2. Micron accelerates HBM production expansion and plans dual bases in the United States and Malaysia
Driven by demand for AI computing power, Micron is actively expanding
HBM High Bandwidth MemoryProduction capacity: A new HBM advanced test production line was built in the United States, and the mass production plan for Malaysia was evaluated for the first time.
The company’s goal in 2025 is to
HBM’s market share triples to around 20%, seize the incremental dividends of HBM brought by AI servers and high-performance computing.
3. Q2 revenue of major wafer equipment manufacturers fell 9% year-on-year, and the Chinese market bucked the trend and experienced high growth
Counterpoint data shows that the revenue of the world’s top five wafer equipment manufacturers in the first quarter of 2024
down 9% year-on-year; Among them, ASML and Tokyo Electronics fell by 21% and 14% respectively, and Applied Materials, Lam, and KLA experienced single-digit declines.
The structural differentiation is obvious:
- fromChina market revenue surged 116% year-on-year, mainly benefiting from the increase in DRAM equipment shipments;
- Storage equipment revenue +33% year-on-year, AI drives DRAM and NAND capital expenditures to strengthen;
- OEM equipment revenue - 29% year-on-year, due to the delay in customers' investment in advanced processes.The organization predicts that automobiles, 5G, and the Internet of Things will drive demand for mature processes and will support the subsequent recovery of the equipment market.
4. Intel 3 process officially enters mass production, and the four-year five-node plan enters the sprint
The Intel 3 process has been mass-produced as scheduled, and will be the first to be equipped with the Sierra Forest Xeon 6 energy-efficiency core version, and the Granite Rapids performance core version will be adopted simultaneously in the third quarter.
Process highlights:
- Compared with Intel 4 logic shrinkage of about 10%,17% better performance per watt；
- Introduce EUV lithography into more processes, use high-density design libraries, and optimize interconnect stacks;
- The yield rate and production capacity ramp up faster than the previous generation, and multiple derivative versions will be iterated to adapt to diverse customers.Intel 3 is also IntelOpen foundry’s first main node, marking that its four-year and five-process node plan has entered the final sprint and officially entered the semiconductor angstrom era.
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