[Core Information] Samsung is rumored to stop producing DDR4 memory, and Micron launches department reorganization for AI

1. Samsung issued a letter to stop production of many DDR4 models, EOL at the end of the year, fully betting on DDR5/LPDDR5

• Samsung has notified customers: Multiple models8GB/16GB DDR4 SODIMM/UDIMMwill beEnd of production (EOL) at the end of 2025
• Last order: early June，Last shipped: December 10
• Take the lead in reducing production:1y 16Gb DDR4Pellets supply will be significantly tightened
• The industry is shifting simultaneously:
  • Micron: DiscontinuedServer-side old process DDR4
  • SK Hynix: Plans to reduce DDR4 production capacity toBelow 20%
• Impact: DDR4 supply is tightening,Forces PC/OEM to accelerate switching to DDR5

2. Passenger Car Association: Tariffs will further promote the localization of automotive chips

• At present, the overall localization rate of domestic automotive chips is about20%, higher for state-owned automobile companies
• Under pressure from tariffs,Analog chip replacement is fastest
• Digital chips are still dominated by foreign investment, and there is huge room for subsequent substitution.

3. Micron reorganizes four major business units to fully anchor AI storage

1. Cloud Memory Business Unit (CMBU): Mainly focusing on cloud vendors and data centersHBM
2. Core Data Center Business Unit (CDBU): Data center memory + storage for OEMs
3. Mobile and Client Business Unit (MCBU): Terminal storage such as mobile phones and PCs
4. Automotive and Embedded Business Unit (AEBU): Automotive, industrial, consumer storage

4. Intel CEO Chen Liwu made a big move: It is said that he will lay off more than 20% of his staff.

• Scale of layoffs: expected to exceed20%, involving about21,000 people(Total employees approximately 108,900)
• Purpose: Streamline management, rebuild engineering culture, improve efficiency and reduce costs
• Structural adjustment: key chip departments willReports directly to the CEO

5. Renesas releases RA0E2 low-power MCU, compatible with previous generations

• Kernel:Arm Cortex-M23
• Highlights:Ultra low power consumption, wide temperature range, high integration
• Voltage:1.6V–5.5VWide voltage, 5V system does not require level conversion, reducing BOM cost
• Package: Minimum5×5mm 32-pin QFN, focusing on cost-sensitive applications
• Compatible with RA0E1 software and hardware, allowing customers to smoothly upgrade

6. SK hynix completes CXL 2.0 DDR5 customer verification

• Products:CMM-DDR5 96GB, based on CXL 2.0
• Improvement: Capacity **+50%, bandwidth+30%, the highest36GB/s**
• Next generation: simultaneous advancement128GB CXL DRAMCustomer verification
• Ecology: Self-researchedHMSDKHas been connected to the Linux kernel to improve the CXL software ecosystem