[Core News] Infineon announces full-year results, domestic mobile phones face cost pressure

1. Infineon 2024 fiscal year: overall decline, automotive business slightly increased

• Q4 revenue was 3.919 billion euros (year-on-year - 6%, month-on-month + 6%), gross profit margin 40.2%
• Full-year revenue was 14.955 billion euros (-8.3%), and operating profit plummeted 44.5%
• The automotive business achieved **+2%** for the full year, while the rest of the sectors declined across the board.
• CEO: Almost no growth except AI; revenue will still decline slightly in fiscal 2025

2. The price of components has increased, and the prices of domestic mobile phones have increased across the board.

• The starting price of Xiaomi Mi 15 is raised by 500 yuan, and the industry is ushering in a collective price increase
• Main reason: rising costs of core components such as processors, storage, cameras, and screens
• Huawei Mate 70 also faces price increase pressure

3. The storage delivery time is greatly shortened, and the processor/RF delivery time is lengthened.

• Storage and delivery period3 weeks shorter, down to 12 weeks
• RF, embedded processor/controller delivery time **+9%**
• Circuit protection device delivery time - 12%

4. Kioxia Q2 revenue nearly doubled year-on-year, and NAND volume and price both increased

• Revenue 480.9 billion yen, +12.22% month-on-month
• Net profit was 106.2 billion yen, +52.15% month-on-month, and net profit margin was 22%
• NAND bit shipments +10%, average price + about 5% month-on-month

5. Samsung plans to sell the old production line of its Xi'an factory to focus on high-end storage

• Plans to sell Xi'an factory100-layer 3D NANDOld equipment and production lines
• Sales will be officially launched in 2025 to promote cost reduction and production line upgrades

6. Korean storage giants cut DDR4 production capacity and shift to DDR5/HBM

• SK Hynix: DDR4 production capacity ratio dropped to 30% in Q3, Q4 target is 20%
• Samsung simultaneously reduces DDR4 and switches to DDR5/LPDDR5
• The consumer side is still dominated by DDR4, with obvious price advantages.

7. National production car grade MCU DF30 released, ASIL-D grade

• Based onRISC-V, Domestic 40nm automotive standard process, the whole process is independently controllable
• The safety level reachesASIL-D, adapted to domestic AutoSAR
• Applied to power, body, chassis, ADAS, etc.

8. ON Semiconductor launches 65nm Treo analog/mixed-signal platform

• 65nm BCD process, modular SoC architecture
• Samples of power supply, AFE, LDO, sensors and other products have been sent
• Expand to automotive LED drivers, security ICs, interconnect chips, etc. in 2025