[Core Information] TSMC acquires Innolux panel factory, Texas Instruments receives factory construction subsidies
1. TSMC acquires Innolux panel factory to increase investment in advanced packaging
TSMC isNT$17.14 billionAcquired Innolux’s 5.5-generation LCD factory in Tainan Science and Technology Park, covering an area of over 96,000 square meters, to rapidly expand CoWoS advanced packaging production capacity.For Innolux, this move realizes the realization of idle assets; TSMC uses this to shorten the production capacity expansion cycle to one year, effectively alleviating the pressure of AI chip packaging shortage.
2. Texas Instruments received US$1.6 billion in subsidies to build a 300mm wafer fab
Texas Instruments wins U.S. chip bill
$1.6 billion in grants + $3 billion in loans, used in the construction of a total of three 300mm wafer fabs in Sherman, Texas (2) and Lehi, Utah (1).The total investment in the project exceeds US$18 billion, focusing on the 28-130nm mature process, strengthening the production capacity of analog and embedded chips, and is expected to be put into production before 2029.
3. Jinghe Integration teamed up with SmartSite to trial-produce 180-megapixel full-frame CIS
Jinghe Integration teamed up with SmartSite to successfully trial production based on its own 55nm process.The industry’s first 180-megapixel full-frame CIS(2.77 inches).The product supports 8K 30fps HDR, breaking through Sony's long-term monopoly. It adopts photolithography splicing technology, takes into account the yield rate and photoelectric performance consistency, and is suitable for multiple types of optical lenses.
4. SoftBank AI chip foundry abandons Intel and switches to TSMC
SoftBank terminates AI chip foundry cooperation with Intel and switches to TSMC.SoftBank had previously planned to invest hundreds of billions of dollars to lay out AI chips (compared to NVIDIA). Because it was worried that the Intel 3/20A process could not meet production capacity and performance needs, it finally chose TSMC's advanced process to ensure the mass production and delivery capabilities of AI chips.
5. Demand is increasing, and NAND IC sales are expected to double this year
TechInsights predicts that AI data centers will drive demand for high-capacity and high-performance NAND.NAND IC sales will increase by 99% year-on-year in 2024, maintaining double-digit growth in 2025.Data center SSD has become the core growth engine. Although the recovery on the consumer side is slow, strong enterprise-level demand supports high growth throughout the year.
6. GaN power component market explodes, AI servers become core growth
TrendForce data shows that the global GaN power component market size will be US$271 million in 2023.Will reach US$4.376 billion in 2030, with a compound annual growth rate of 49%.Consumer electronics fast charging is the basic base, and AI server power demand is exploding. AI servers are expected to account for 12.2% in 2024, promoting the accelerated penetration of GaN in high-power and high-efficiency scenarios.
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