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[Core News] AI Boosts Memory Demand, Samsung Resumes Investment In New Semiconductor Factories

[Core News] AI boosts memory demand, Samsung resumes investment in new semiconductor factories


  1. 1. AI-driven storage demand surges, Samsung resumes investment in Pyeongtaek P5 semiconductor plant

According to the Science and Technology Innovation Board Daily, Samsung Electronics has officially resumed infrastructure construction of P5, a new semiconductor factory in Pyeongtaek.The factory was temporarily suspended at the end of January. At that time, Samsung said that the suspension was a temporary measure for progress coordination. The core reason was that the investment had not yet been received.

The core motivation for this resumption of construction is the rapid rise in demand for storage semiconductors driven by the artificial intelligence boom. Samsung has restarted the construction of new factories to expand production capacity to cope with the surge in market demand and consolidate its leading position in the storage field.


2. The supply of Nvidia GB200 chips exceeds the demand, and packaging and testing factories are facing a rush to pursue orders.

According to the Science and Technology Innovation Board Daily citing China's Taiwan Economic Daily, Nvidia's GB200 and B-series AI chip customer introductions have increased significantly. After adding TSMC's advanced process wafers in the early stage, the order-chasing effect further spread to the later packaging and testing stages. ASE Investment Control and KYEC are ushering in a period of operational explosion.

Sources revealed that the additional NVIDIA orders undertaken by KYEC are already full, and it is necessary to adjust production capacity allocation and move more production capacity to meet NVIDIA's order demand.


3. Wolfspeed postpones the construction of a factory in Germany, and the start of construction is delayed by two years

According to Reuters news quoted by the Science and Technology Innovation Board Daily, silicon carbide (SiC) supplier Wolfspeed announced that it will postpone the construction plan of a US$3 billion semiconductor factory in Saarland, Germany. The factory is mainly used to produce chips for electric vehicles. It has not yet been completely cancelled. The company is still actively seeking financial support.

Affected by the weak demand in the electric vehicle market in Europe and the United States, Wolfspeed has cut capital expenditures and is currently focusing on increasing the output of the New York factory. The German factory will start construction as early as mid-2025, two years later than the original plan.


4. Renesas completes acquisition of Transphorm and integrates automotive-grade GaN technology

Renesas officially announced that as of June 20, 2024, it has completed its wholly-owned acquisition of Transphorm, the global gallium nitride (GaN) leader.After the acquisition is completed, Renesas will immediately launch GaN-based power products and related reference designs to meet the growing market demand for wide-bandgap semiconductors.

On the day of the acquisition, Renesas simultaneously released 15 new design portfolios, which deeply integrate Transphorm's GaN technology with its own embedded processing, power supply, connection and other products, covering a variety of solutions such as 500W on-board chargers for two-wheeled electric vehicles, three-in-one electric vehicle power systems, 240W AC/DC adapters, and 3.6KW bidirectional digital power supplies, with a focus on in-vehicle GaN application scenarios.


5. Samsung’s 3nm SF3 process yield is only 20%, but it still insists on promoting Exynos 2500

According to industry reports cited by Kuai Technology, Samsung’s first smartphone SoC using SF3 process (3nm level), Exynos 2500, currently has a yield rate of only 20%, which is far from reaching mass production standards. However, Samsung has not given up and is fully promoting technology optimization, with the goal of increasing the yield rate to 60% by October 2024.
Compared with the previous generation 4nm FinFET process, Exynos 2500 is expected to increase energy efficiency and density by 20%-30%. It will also use fan-out wafer-level packaging (FoWLP) technology to reduce package size, control chip heat, and improve multi-core performance and battery life.It is worth noting that Qualcomm plans to release the fourth-generation Snapdragon 8 mobile platform in October. If Samsung cannot solve the yield problem on time, it may miss the mobile chip competition window.


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