Summary Of Component Price Increases Since The Beginning Of The Year: TI And NXP Are Newly Added, Effective In April!

1. Panoramic view of price increase tide: four underlying driving logics

1. Cost floor: upstream precious metals and materials surge across the board

• Domestic copper prices break through100,000 yuan/ton, a year-on-year increase of over35%
• Silver from approx.5900 yuan/kgsurge to18,000 yuan/kg, an increase of more than200%
• The costs of wafer foundry, packaging and testing, energy, and logistics are rising simultaneously, forming a cost floor that is difficult to avoid for the entire industry chain.

2. Engine of change: AI capacity siphon effect detonates supply and demand imbalance

• MLCC usage is that of a normal serverseveral times to 10 times
• Demand for high-power MOSFET, IGBT, and HBM memory surges simultaneously
• Wafer fabs will shift production capacity to advanced processes,The 8-inch mature process capacity is seriously squeezed, resulting in an overall tight supply of general MCUs, analog chips, and power devices.

3. Conduction form: full-chain conduction + structural differentiation

• Strongly related categories: Products in the fields of AI, automotive electronics, and industrial control are in short supply, with strong pricing power and the highest growth rates.
• General category: The demand recovery in the consumer electronics field is weak, and price increases are weak and even under pressure.

4. Value reconstruction: shifting to technology and scarce links

• Fortress of value: For companies that control core materials and technologies, profits are firmly locked in
• Transfer of pricing power: Companies with high-end chips, advanced processes, and high-reliability devices have transformed from price takers to price setters.
• cost depression: There is no barrier in the mid- to low-end manufacturing process, and profits continue to be diluted due to squeeze from upstream and downstream.

2. Price adjustment details of core manufacturers (effective from April 1st)

1. TI (Texas Instruments): Analog leader raises prices across the board for second time

• Effective time: April 1, 2026 (the second comprehensive price increase during the year)
• Increase range：15%–85%(Mainstream 15%–30%, some products up to 85%)
• core coverage:Digital isolator, isolation driver chip,Power management IC, industrial/automotive grade analog chips, embedded products
• Representative model: TPS5430DDAR, TMS320F28335PGFA, INA139NA/3K, TPS82130SILR, ADS1115IDGSR, etc., all appearSearch volume skyrockets + quotes jump

2. NXP (NXP): Automotive MCUs lead price adjustment

• Effective time: April 1, 2026
• Increase range：5%–15%(Mainstream 10%–20%)
• core coverage：Automotive grade MCU, vehicle network chips, industrial-grade analog chips, security chips
• Representative model: LPC1768FBD100, LPC1788FBD208, MMA8452QR1, PCF8563T/5, etc. The search volume has increased significantly with the expected price increase.

3. Other major international manufacturers will follow suit.

4. Memory: structural shortage, unilateral rise

• Micron MT41K256M16TW-107:P (DDR3L)：Industry/communication/automotive widely used, priceUnilateral rise, the core is tilted towards AI servers due to original factory production capacity, DDR3 production capacity is scarce but the demand is huge
• Winbond W25Q128JVSIQ (NOR Flash): The main wave surged from January to February, and the high level has stabilized since February. The most tense stage may have passed.
• Samsung / Hynix: DRAM price increases60%–100%, server level nearly doubled

5. Other hot categories: drones, AI computing power, sensor explosion

• STM32 series: ST will prioritize the allocation of 8-inch production capacity to vehicle sizes, and GM’s F1/F4 series production capacity will be compressed.STM32F405RGT6(UAV flight control) topped the list of hot searches
• ICM-42688-P（TDK IMU）: The demand for drones, wearables, and robots has exploded, shifting from hot spots toStructural rigid needs
• ISL99390FRZ-TR5935 (Renesas 90A power stage): AI server power core, search volume and quotationbig jump, is a typical epitome of the shortage of computing power infrastructure + power chips

3. Market Impact and Response

1. Downstream cost pressure intensifies

• Industrial control, communication equipment, consumer electronics, medical equipment, automotive electronics and other fieldsrising costs, the terminal price may be gradually raised
• Small and medium-sized manufacturers faceSupply risk + cost squeezedouble challenge

2. Structural opportunities highlighted

• High technical barriersof analog, power, and automotive chip manufacturers,Pricing power and profitsContinuous improvement
• Domestic replacementThe window is open, and the orders and share of leading domestic chip manufacturers are expected to increase
• AI, automotive electronics, industrial controlWaiting for the track, demand is rigid and prosperity continues to rise

3. Procurement response strategies

• Lock in inventory in advance: Targeting high-growth, high-shortage models from core manufacturers such as TI, NXP, and ST
• ** diversify supply chain **: Expand domestic alternatives and reduce reliance on a single original manufacturer
• Pay attention to Chuangxin Index: Understand price, search volume, supply and demand changes in real time, and make accurate decisions

Conclusion