Since the beginning of the year, power semiconductors have officially launchedDomestic + international manufacturers raise prices simultaneously, combined with Nvidia’s performance exceeding expectations, memory chips entering the seller’s market, and TI/ST/NXP’s centralized price adjustment in April, the electronics industry chain is enteringDriven by AI computing power, production capacity is siphoned off, prices are rising across the board, and terminals are under pressureperiod of deep reconstruction.
1. Power semiconductor price increases: Domestic and foreign manufacturers collectively raise prices, which will take effect in March
1. Domestic power manufacturers take the lead in raising prices
- New clean energy: MOSFET prices will increase starting from March 1stStarting from 10%, the new price will be implemented simultaneously for unshipped orders, mainly due to the skyrocketing costs of precious metals, wafers, and packaging and testing + the tight demand for AI servers.
- Macro Micro Technology: IGBT single tube/module and MOSFET prices will increase starting from Marchabout 10%, the cost pressure on upstream non-ferrous metals is significant.
- Shilanwei: Starting from March 1, the price of some chips will increase by 10%.
- China Resources Micro: Price increases for all series of products starting from February 1Minimum 10%。
2. International giants follow up simultaneously
- Infineon: Prices of power switches, IGBTs, SiC and other products will be raised starting from April 1.
- ADI: Multiple rounds of price increases have been launched at the end of 2025 and will continue to be conducted in 2026.
After memory and analog chips, power devices have becomeAnother core track with price increases across the board。
2. Nvidia’s performance exploded across the board, and the demand for AI computing power exploded exponentially.
Nvidia’s fiscal year 2026 Q4 and full-year financial reports greatly exceeded expectations:
- Q4 revenue: US$68.1 billion (+73% year-on-year)
- net profit: US$42.96 billion (+94% year-on-year)
- Gross profit margin：75%
- data center: Revenue of US$62.3 billion, +75% year-on-year, accounting for 91% of total revenue
- FY27 Q1 Guidance: Revenue of US$78 billion, significantly higher than market expectations
Huang Renxun said bluntly:Agentic AI has reached an inflection point, and computing requirements are increasing exponentially, directly triggering the demand for power devices, power management, HBM/DRAM, and high-current chips.
3. Storage enters the seller’s market: prices continue to skyrocket, and production capacity is fully shifted to AI
1. SK Hynix made it clear: storage prices will increase throughout the year in 2026
- DRAM/NAND stock only approx.4 weeks, all customer needs cannot be met
- HBM’s annual production capacity is sold out, there is a serious shortage of standard DRAM, and the bargaining power lies entirely with the upstream
- The industry is rapidly shifting from annual/quarterly contractsmonthly price negotiation
2. Samsung stops production of 2D NAND and switches to advanced manufacturing processes
Samsung has shut down its Hwaseong 2D NAND production line since March and shifted production capacity to 1c nm DRAM, further exacerbating the niche storage supply gap.
3. SK Hynix invests US$15 billion to build new AI chip factory
21.6 trillion won (approximately US$15.07 billion) will be invested in the construction of a new production line in Yongin, which will be completed before 2030, fully betting on AI high computing power storage.
4. Dramatic changes in the industrial structure: shrinking production capacity + rising costs + explosive demand resonance
1. ASML EUV light source moves towards 1000W, competition in advanced processes intensifies
The next-generation EUV production capacity and efficiency have been greatly improved, further increasing the resource tilt between advanced processes and mature processes.
2. Bosch shuts down its German factory and transfers production capacity to Asia
Due to declining demand for traditional fuel vehicle connectors and high costs in Europe, Bosch will close its Waiblingen factory by 2028 and shift its production capacity to China and Thailand, accelerating the restructuring of the global supply chain.
3. Humanoid robots enter an explosive period
Revenue CAGR from 2025 to 2027 is as high as188.14%, Chinese manufacturers lead the world, driving a new round of demand for IMU, MCU, sensors, and power devices.
5. Panorama of core popular material numbers: price increase + shortage driven by dual main lines
1) TI raised prices for the second time in April (15%–85%), and the entire series increased in volume and price
- TPS5430DDAR: DC-DC power supply, search volume + price skyrocketed simultaneously
- TMS320F28335PGFA：C2000 industrial control MCU, the price is over 100 yuan
- INA139、INA226、TPS82130、ADS1115、ISO1050Analog, current sensing, isolation, ADC all moved higher
2) ST MCU: 8-inch wafers are in short supply, and general models are in short supply across the board
- STM32F405RGT6：UAV flight control master, the first hot search
- STM32F103C8T6: Classic models make a strong return
- The entire F030/H743/F407 series is in short supply, and global 8-inch production capacity is expected to shrink by 2.4% in 2026
3) NXP adjusted prices in April, and industrial MCUs strengthened simultaneously
- LPC1768、LPC1788Industrial control core
- MMA8452, PCF8563T, etc. followed the price increase expectations and rose
4) Structural surge in storage
- MT41K256M16TW-107:PMicron DDR3L: Industrial/automotive rigid demand, unilateral rise
- W25Q128JVSIQWinbond NOR Flash: Stabilizing at a high level, supply and demand are tightly balanced
5) AI + UAV + Robot Core Devices
- ICM-42688-P：IMU sensing, structural rigid need
- ISL99390FRZ-TR5935: Renesas 90A power stage, AI server power core, quotation jumps
- MP9943GQ-Z、EFM8BB21: Drone power supply/ESC main control continues to be overheated
Conclusion: The three main lines for 2026 have been determined
- AI computing power: NVIDIA continues to exceed expectations, driving demand across the board for power, power, and storage.
- Price increases across the board: Power→Storage→Analog→MCU→Passive components, transmitted to mobile phone/PC terminal
- Capacity differentiation: 8-inch shortage, mature process extrusion, structural shortage of niche materials
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