[Core News] DrMOS devices overheat, affecting the mass production of Nvidia’s next-generation AI system

1. DrMOS overheating hinders Nvidia’s GB300/B300 mass production

• Source of the problem: Chip design defects + insufficient system power management
• Nvidia’s original intention: Introducing AOS to check and balance MPS and reduce costs
• Alternatives: Switch toMPS 5x6 DrMOS(Stronger heat dissipation, higher price)
• risk: If it cannot be solved,Mass production or delay

2. GB200 cabinet supply chain optimization, expected to increase in volume in Q2 of 2025

• Volume increase time point：After Q2 2025Gradually increase the amount
• main plan：GB200 NVL72Accounting for nearly 80% in 2025
• customer groups: Large cloud service providers, national sovereign cloud, scientific research HPC

3. UMC wins a large order from Qualcomm for advanced packaging, breaking TSMC’s monopoly

• core technology：WoW hybrid bonding + PoP packaging, replacing traditional solder balls
• Division of labor: QualcommOryon CoreTSMC OEM, UMC packaging
• meaning:BreakthroughTSMC / Intel / SamsungAdvanced packaging monopoly

4. NXP acquires Aviva Links for US$242.5 million to strengthen in-vehicle networks

• Technical Highlights：ASA standard, the speed reaches16Gbps
• Product coverage：ASA-ML peer-to-peer、ASA-MLE Ethernet
• Customer Progress: Obtained2 mainstream car companiesFixed point

5. ON Semiconductor × Denso deepens ADAS/autonomous driving cooperation

• core supply:Smart sensors, power devices
• strategic goals:PromoteAutonomous driving safety, Ensure stable supply of chips