[Core News] ROHM and Bosch layout gallium nitride and silicon carbide power devices to meet automotive needs
1. Rohm x TSMC deepen cooperation to develop automotive GaN power devices
Rohm and TSMC establish strategic partnership to jointly develop and mass produce
Automotive grade gallium nitride (GaN) power devices。
The two parties will combine Rohm's device design capabilities with TSMC's
GaN-on-SiliconProcess advantages to create high voltage and high frequency power devices.
The two parties have previously cooperated to launch 650V EcoGaN products in 2023, which have been used in consumer electronics and industrial power supplies in batches.
2. Bosch received US$225 million in U.S. subsidies to expand production of SiC power devices in California
The U.S. Department of Commerce intends to provide Bosch with
US$225 million in subsidies + US$350 million in government loans, supporting production at its Roseville, Calif., facility
Silicon carbide (SiC) power devices。
The project has a total investment of approximately US$1.9 billion and is mainly targeted at key applications such as new energy vehicle electric drives and OBC.
3. Apple will mass-produce and develop its own 5G baseband next year to reduce dependence on Broadcom
Apple’s self-developed 5G baseband chip (codenamed Proxima) will be launched
2025Mass production, manufactured by TSMC, first launched on
iPhone 17 Air。
At the same time, Apple is also developing its own Bluetooth/Wi-Fi chips and plans to implement them
5G + Bluetooth + Wi-FiHighly integrated, further reducing dependence on Broadcom and Qualcomm;
Cooperation with Broadcom will still be maintained in fields such as filters and server chips.
4. Rapidus teamed up with Cadence to develop 2nm GAA + backside power supply process
Japan's Rapidus and EDA giant Cadence have reached a cooperation to jointly promote
2nm GAAand
BSPDN back power supply networkTechnology research and development.
BSPDN is a key technology for the next generation of advanced processes. Intel 18A (2025), TSMC A16 (second half of 2026), and Samsung SF2Z (2027) have all been planned for implementation.
5. ST and Qualcomm launch the first IoT module ST67W611M1
STMicroelectronics releases first wireless IoT module in partnership with Qualcomm
ST67W611M1, built-in Qualcomm QCC743 SoC, supports Wi-Fi 6, Bluetooth 5.3, Thread and Matter protocols, and can easily connect to the STM32 ecosystem.
Samples are now available and expected
OEM version will be available in Q1 in 2025, and Q2 will be generally available.。
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