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WsxMall > Industry Information > [Core Information] DRAM Price Outlook Next Year Will Fall, Nvidia’S New Chips Face Delivery Delays

[Core Information] DRAM Price Outlook Next Year Will Fall, Nvidia’S New Chips Face Delivery Delays

[Core Information] DRAM price outlook next year will fall, Nvidia’s new chips face delivery delays


1. Institutions: DRAM prices will fall across the board in 2025

  • DDR4/LPDDR4X due toSufficient supply, weak demandAlready the first to fall
  • DDR5/LPDDR5X is affected by high inventory,There is a high probability of falling from the end of 2024 to 2025

2. NVIDIA Blackwell chips encounter heat dissipation problems and delivery is delayed

  • Blackwell GPUs in 72-bit high-density rackssevere overheating
  • NVIDIA requires suppliersRedesign server racks, delivery time is delayed

3. BOE invested RMB 33 billion to build a 12-inch wafer fab, with mass production by the end of 2026

  • Products: display driver, digital-analog hybrid,MCUWait
  • Process: 28–55nm, planned monthly production capacity50,000 pieces
  • Progress: Start in 2024, move in Q4 equipment in 2025, mass production by the end of 2026

4. Hon Hai: Capture at least 40% of global AI server share by 2025

  • Production capacity is ready to handle NVIDIA GB200 orders
  • Electric vehicle business andTwo Japanese car companiesNegotiate cooperation and postpone next year’s share target

5. NXP releases i.MX 94 application processor, focusing on automotive/industrial

  • Configuration: 4×A55 + 2×M33 + 2×M series cores
  • Features: Integrated2.5Gbps TSN Ethernet switch, high real-time and security
  • Sample delivery will begin in Q1, 2025

6. Infineon launches new linear MOSFET, adapted for AI servers

  • OptiMOS 5 Linear FET 2
  • higherSOA secure workspace, lower gate leakage current, supports multiple parallel connections, and reduces BOM cost

7. Phison releases 128TB enterprise-class PCIe 5.0 SSD

  • Model: PASCARI D205V
  • Solution: PCIe 5.0 x2 master + 2Tb 3D QLC
  • For AI data centers, taking into account large capacity, low power consumption and heat dissipation optimization


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