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[Core News] AI Applications Push Up The Price Of Copper Foil Substrates, And TSMC’S Advanced Technology And Packaging Are Reported To Increase Prices Again
[Core News] AI applications push up the price of copper foil substrates, and TSMC’s advanced technology and packaging are reported to increase prices again1. Mid- to low-end CCL prices rose nearly 10% due to tight produc...
Industry Information 2026-05-06 14:09:46 0 -
IC Trading Network Hongmeng’S Native Application Opens Public Beta, Heading Into The Era Of All-Scenario Intelligent Connectivity
IC trading network Hongmeng’s native application opens public beta, heading into the era of all-scenario intelligent connectivity1. Hongmeng ecological outlet, IC trading network takes the lead in layoutinHarmonyOS NEXT...
Industry Information 2026-04-24 14:14:53 2 -
Overview Of MCU Process Changes: Development Paths Under The Tide Of AI Application And Cost Reduction
Overview of MCU process changes: development paths under the tide of AI application and cost reductionTraditional MCUs focus on home appliances and industrial control, with more emphasis onStability, power consumption, c...
Industry Information 2026-04-21 14:07:56 2 -
Overview Of MCU Process Changes: Development Paths Under The Tide Of AI Application And Cost Reduction
Overview of MCU process changes: development paths under the tide of AI application and cost reductionTraditional MCUs useStable, low power consumption, low costas the core and stay in it for a long time40nm and above ma...
Industry Information 2026-04-20 14:33:13 2 -
2025 China International Sensor Technology And Application Exhibition (Sensor Expo 2025)
2025 China International Sensor Technology and Application Exhibition (Sensor Expo 2025)Basic informationtime: July 2-4, 2025location:Shanghai New International Expo CenterTopic: Perceive the world and win the future wit...
Industry Information 2026-04-17 14:46:26 2 -
Supply Chain Security And New Applications Drive Chip Manufacturers To Accelerate The Deployment Of Localized Production Capacity
Supply chain security and new applications drive chip manufacturers to accelerate the deployment of localized production capacityGlobal chip production capacity is surroundingsupply chain securitywithAI / Automotive / Ne...
Industry Information 2026-04-16 14:30:37 2 -
A Quick Overview Of The Original Envm Solutions Of Major Mcus: For New Applications Such As Automotive And Edge AI
A quick overview of the original eNVM solutions of major MCUs: for new applications such as automotive and edge AIAs the MCU enters28nm/16nm advanced process, traditional eFlash has prominent bottlenecks in terms of diff...
Industry Information 2026-04-16 14:13:39 2 -
2025 The 6Th Shenzhen International Chip, Module And Application Solutions Exhibition
2025 The 6th Shenzhen International Chip, Module and Application Solutions ExhibitionBasic information of the exhibitionExhibition name: 2025 The 6th Shenzhen International Chip, Module and Application Solutions Exhibiti...
Industry Information 2026-04-14 14:29:37 2 -
Introduction To BLDC Drive Circuit Architecture: New Applications Drive The Trend Of High Integration
Introduction to BLDC drive circuit architecture: new applications drive the trend of high integrationBrushless DC motors (BLDC) have become the mainstream choice in industry, automobiles, home appliances, AI server cooli...
Industry Information 2026-04-13 14:16:24 2 -
Introduction To The Types, Common Models And Application Fields Of Universal Interface Chips
The universal interface chip is the **translator and transportation hub** of the electronic system. It is responsible for data interaction, level conversion, and signal isolation between chips, devices, and systems. Alth...
Industry Information 2026-03-28 14:02:13 2
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