2025 The 6th Shenzhen International Chip, Module and Application Solutions Exhibition
Basic information of the exhibition
- Exhibition name: 2025 The 6th Shenzhen International Chip, Module and Application Solutions Exhibition (CHIP-EXPO)
- Exhibition time: August 26-28, 2025
- Exhibition location:Shenzhen International Convention and Exhibition Center (Baoan New Hall)
Exhibition scale and positioning
- Exhibition positioning: The leading exhibition platform for supply and demand docking of chips and innovative application solutions in China, integrating display, procurement and technical exchanges.
- Exhibition area:40000㎡+
- Exhibitors:**600+** home
- professional audience: **50000+** buyers and industry professionals
- Supporting activities: **20+** technical forums and new product launches
Core audiences and buyers
Covering the entire industrial chain downstream application fields:
- car: New energy, autonomous driving
- Consumer Electronics/Smart Home:Mobile phones, computers, home appliances
- Internet of Things/Communications: IoT, 5G/6G, data center
- Industrial/Medical/Security:Industrial control, medical electronics, security monitoring
- AI / cutting-edge technology: Artificial intelligence, cloud computing, edge computing
- High-end field: National defense and military, aerospace
Well-known buyers (some)
Huawei, Apple, Tesla, BYD, Xiaomi, Samsung, Geely, NIO, OPPO, vivo, Haier, Midea, Gree, Hisense, Honor, Lenovo, Bosch, Siemens, LG, Dell, HP, Transsion, TCL, Konka, ZTE, DJI, iFlytek, Skyworth, Galanz, Foxconn, Luxshare Precision, etc.
Exhibition scope
1. Chips and modules
- Processor, storage, communications, IoT, automotive electronics, sensors
- Power management, power devices, logic/protection/display/audio/RF chips
- AI chips, FPGA, ASIC, optical chips, biomedical chips, edge computing chips, etc.
2. Application solutions
- Automotive grade, consumer electronics, smart home appliances, smart home
- Internet of Things, communications, new energy, security, medical, industrial control
- Data center, cloud computing, AI, aerospace, financial security and other solutions
Technical Forum (Part)
- China Automotive Grade Chip and Innovative Application Solutions Forum
- China Consumer Electronics Chip and Innovative Application Solutions Forum
- China Smart Home Appliances/Smart Home Chips and Innovative Application Solutions Forum
- Internet of Things (IoT) Chips and Innovative Application Solutions Forum
- AI Artificial Intelligence Chip and Innovative Application Solutions Forum
Exhibition value: Relying on Shenzhen's electronic information industry highland, connecting upstream chip companies and downstream complete machine/brand manufacturers to helpDomestic substitution, technology docking, order landing, is an important business and technology exchange platform for the chip industry in the second half of 2025.