[Core Information] ST cooperates with Innosec to merge the foundry industry

1. STMicroelectronics × Innosec: GaN technology alliance

• Technical collaboration: Jointly develop next-generation GaN power technology, focusing onConsumer electronics, data center, automotive, industrial power supplyContour growth scenario.
• Capacity complementation: Innosec can use ST's European production capacity; ST can rely on InnosecChina 8-inch GaN production line, two-way strengthening supply chain resilience and global delivery capabilities.
  

2. UMC & GLOBALFOUNDRIES: Transaction merger, intends to challenge Samsung OEM

• Industry impact: Both parties each occupy approximately5%Global foundry share, the combined market share is nearly10%, hopefullyBeyond Samsung, becomeThe world’s second largest pure-play foundry(Second only to TSMC).
• Business response: United Microelectronics statedNo response to rumors, no merger is currently underway。
• core challenge: Cross-regional and cross-campus mergers and acquisitions must passChina, America and EuropeMultiple regulatory reviews make it difficult to integrate technology and culture.
  

  

3. UMC Singapore Plant: US$5 billion expansion completed

• Investment scale：First phase investment$5 billion, monthly production capacity30,000 12-inch wafers, mass production in 2026.
• Technical positioning: Main22nm/28nmMature manufacturing process for Singaporemost advancedOne of the foundriesUMC。
• Capacity target: After full production, the total annual production capacity of the Singapore base willOver 1 million pieces12-inch wafer, hardenedAutomotive, IoT, AI, communicationsGlobal supply of chips.
  

  

4. Storage market: Prices rise, HBM production capacity surges

1. Memory price increase + production expansion wave

• Original factory production reduction in 202415%-25%Destocking, 2025DRAM/NAND prices continue to rise。
• AI-driven HBM demand explodes, Micron, Samsung, SK HynixIncrease prices across the board and accelerate production expansion。

2. SK Hynix: HBM packaging production line transformation completed

• Icheon, South KoreaM10F factoryTransform HBM package,Mass production at the end of March。
• Added monthly production capacity of 10,000 pieces, the total HBM packaging capacity reaches130,000 pieces/month。
• Follow Qingzhou at the end of 2025M15XWhen put into production, the total production capacity will be increased to160,000-170,000 pieces/month。

5. New breakthroughs in domestic chips

1. Loongson 2K3000: tapeout successful

• Integrate8-core LA364E (Dragon architecture) + Second generation self-developed GPU LG200。
• Under 2.5GHzSPEC CPU 2006 Base single core fixed point 30 minutes。
• GPGPU computing power:Single precision256GFLOPS, 8 bits8TOPS, supportAI acceleration and 4K video。
• For ** industrial control (2K3000)withMobile terminal (3B6000M)** Dual scenes.
  

2. Ankai Micro: Released low-power smart vision chip

• launchKM01A / KM01W, supports **AOV (Always Online)** technology.
• IntegrateNew generation self-developed NPU+ISP, strengthen image processing and video coding capabilities.
• Main attackAIoT, smart security, smart homevisual scene.

Summary of this week’s highlights

• third generation semiconductor：ST + InnosecGaN Global Division of Labor, accelerating penetration into automotive/industrial grade.
• Mature process reshuffle: UMC/GF merger rumors +Singapore’s 5 billion production expansion, highlightSupply chain diversificationstrategy.
• AI storage is urgently needed：HBM Capacity CompetitionAt a fever pitch, SK hynix leads the world.
• Autonomous chip advancement：Loongson2K3000, An KaiweiKM01Continued breakthroughsIndustrial Control / AIoTmarket.