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WsxMall > Industry Information > [Core Information] Out Of Stock And Price Increase: 8-Inch Wafer Production Capacity Is Further Reduced, And High-End Fiber Cloth Is In Short Supply

[Core Information] Out Of Stock And Price Increase: 8-Inch Wafer Production Capacity Is Further Reduced, And High-End Fiber Cloth Is In Short Supply

  1. Samsung closes an 8-inch wafer fab, significantly reducing monthly production capacity

  2. According to IT House citing Korean media reports, Samsung plans to close its 8-inch wafer fab S7 in the Giheung Park in the second half of 2026. Only two 8-inch wafer fabs, S6 and S8, will continue to operate in the park.This suspension of production will reduce Samsung's monthly 8-inch wafer production capacity from 250,000 wafers to less than 200,000 wafers. Currently, relevant customer orders have begun to be transferred, and the subsequent use of the S7 plant has not yet been determined.It is reported that the overall operating rate of Samsung's 8-inch wafer fab is about 70%. As core products such as CMOS image sensors and display driver chips are transferred to 12-inch production lines, and superimposed R&D resources are concentrated on advanced processes, the operating cost pressure of 8-inch production lines is rising. With limited customers and mass production projects, there is no need to maintain the operation of three 8-inch wafer fabs.
  3. 2. High-end fiberglass cloth is in short supply, and technology giants are fiercely competing for it

  4. According to Kuai Technology citing Nikkei news, the global demand for AI chips has exploded, triggering a supply shortage of its core basic material, high-end glass fiber cloth.This material is the key to manufacturing AI chip carrier boards and high-speed PCBs. It directly determines the chip signal transmission speed and stability. Currently, technology giants such as Apple, Nvidia, Google, Amazon, and Microsoft are fiercely competing for it.To ensure supply, Nvidia CEO Jen-Hsun Huang recently visited industry leader Nittobo in person.Currently, only three manufacturers in the world can produce low-expansion coefficient (Low CTE) high-end fiberglass cloth. Among them, Nittobo holds more than 90% of the global market share and is the only supplier that can meet Nvidia's strict quality requirements. It is in an absolutely dominant position in the supply chain.
  5. 3. DRAM sellers are hoarding goods to push up prices, and the NAND spot market is in a stalemate.

  6. The latest report from TrendForce shows that DRAM spot prices continue to rise. As suppliers and traders are unwilling to release inventory and transaction volume is limited, the average price of mainstream DDR4 1Gx8 3200MT/s chips increased by 9.64%.In terms of NAND flash memory, spot prices rose simultaneously, but transaction volume continued to be sluggish due to high prices, weak demand for consumer goods, and expectations of factory shutdowns during the Lunar New Year.Buyers took a wait-and-see attitude, while spot traders who were optimistic about the future trend refused to cut prices, forming a market stalemate. The average spot price of 512Gb TLC wafers rose by 9.68% this week, reaching $15.052.
  7. 4. SK hynix responds to abandoning consumer business: no relevant plans

  8. According to Kuai Technology News, following Micron, there are rumors that SK Hynix will withdraw from the consumer storage business.In response, SK hynix publicly responded and made it clear that it is not currently discussing or planning to withdraw from the consumer product business.Unlike Micron, which directly sells products under its own brand, SK Hynix does not directly sell to end consumers, but its chips are core components of many consumer products. If it cuts off supply, OEM manufacturers such as Dell and a large number of third-party memory and SSD brands will face a serious food shortage crisis.

    5. TSMC’s 2025Q4 revenue increased by 20.5% year-on-year, with advanced processes as core support

    TSMC announced its fourth quarter financial report for 2025, with consolidated revenue of approximately NT$1,046.09 billion, a year-on-year increase of 20.5%, and a month-on-month increase of 5.7%; net profit was approximately NT$505.74 billion, a year-on-year increase of 35%, and a month-on-month increase of 11.8%; gross profit margin was 62.3%, operating profit margin was 54.0%, and net profit margin was 48.3%.In terms of process, 3-nanometer process shipments accounted for 28% of wafer sales, 5-nanometer accounted for 35%, 7-nanometer accounted for 14%, and advanced process (7-nanometer and more advanced) revenue accounted for 77%.Looking forward to the first quarter of 2026, TSMC expects revenue to be between US$34.6-35.8 billion and gross profit margin of 63%-65%; capital expenditures in 2026 are estimated to be US$52-56 billion.

    6. GlobalFoundries acquires Synopsys’ ARC processor IP business

    Wafer foundry GlobalFoundries (GF) announced that it has acquired Synopsys’ ARC processor IP solutions business, including related engineers and designers.This acquisition covers a full range of product lines such as ARC-V and ARC Classic, as well as dedicated instruction set processor tools such as ASIP Designer. It will accelerate the physical AI roadmap of GF and MIPS, strengthen their customized silicon solution capabilities, help customers shorten product launch cycles, and increase customer participation through intellectual property licensing and software upgrades.

    7. Wolfspeed achieves 300mm silicon carbide wafer technology breakthrough

    Wolfspeed announced that it has successfully developed a single-crystal 300mm (12-inch) silicon carbide wafer. This technological breakthrough lays an important foundation for the development of next-generation computing platforms, immersive AR/VR systems and efficient advanced power devices.The 300mm platform will integrate high-volume silicon carbide manufacturing for power electronics with advanced capabilities in high-purity semi-insulating substrates for optical and radio frequency systems, supporting new wafer-level integration across optics, photonics, thermal and power domains.

    8. SmartSky launches new high-performance automotive-grade CMOS image sensor

    SmartSky announced the launch of the 8.3MP high-performance automotive-grade CMOS image sensor SC860AT. This product is based on the new CARSens-XR Gen 2 Plus technology platform. It has the advantages of high frame rate, high sensitivity, high dynamic range, etc., and can adapt to the image upgrade needs of automotive front-view, side-view, rear-view, cabin occupant monitoring and E-Mirror electronic rearview mirror applications.In addition, the sensor complies with the ISO 26262 ASIL-B automotive functional safety and ISO 21434 automotive network security standards. Samples are currently being accepted and mass production is planned for the second quarter of 2026.


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