[Core News] Micron Terminates Cruda Consumer Business, Winbond Releases New DDR4 Memory Products

1. Micron withdraws from Crucial consumer business

1. Core Decisions and Timeline

• Micron announcedTermination of Crucial consumer storage business, stop selling in global retail, e-commerce and distributor channels
• transition toFebruary 2026 (end of Q2 of this fiscal year), normal sales and warranty provided during the period
• Enterprise-level Micron brand products are not affected and will continue to serve commercial customers.

2. Strategic motivation: AI-driven reallocation of resources

• demand burst: The demand for HBM and high-end DRAM in AI data centers has surged. The DRAM usage of a single AI server is 8 times that of an ordinary server.
• Profit tilt: The gross profit margin of consumer-grade business is only 10%-15%, while the gross profit margin of HBM/enterprise-grade business exceeds 50%
• Capacity priority: Shift limited production capacity from the low-margin consumer marketHigh growth, high profitsAI and Data Center Track

3. Industry impact

• Storage industryAI firstStrategic differentiation intensifies, leading manufacturers collectively shrink consumer-grade production capacity

• Consumer storage market shareDomestic manufacturers(Yangtze River Storage, Changxin Storage) and remaining international brands are tilted

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2. Winbond Electronics releases new 16nm 8Gb DDR4 DRAM product

1. Product core parameters

• process: Winbond owns16nm advanced process, smaller die, higher yield, lower power consumption
• capacity/rate：8Gb capacity，3600Mbps transmission rate(The first in the industry to break through the DDR4 3200Mbps standard)
• Advantages: Larger capacity, stronger signal integrity, and lower leakage rate in the same package

2. Target market

• CoverTV, server, Netcom, industrial computer, embeddedand other diverse scenarios
• adaptLong life cycle, high stabilitydemand to fill the high-performance gap in the mature DDR4 ecosystem

3. Follow-up planning

• Simultaneous development of the same process series:8Gb LPDDR4、16Gb DDR4and other products

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3. ON Semiconductor × Innosec: GaN power device cooperation

• Sign MoU, integrateON Semiconductor Systems/Packaging CapabilitieswithInnosec 200mm GaN process

• focus40-200V power devices, accelerating the popularization of GaN in industry, automobiles, data centers and other fields

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4. SK Hynix plans to launch customized DRAM foundry

• earliest plan2027Provided by Korean FablessCustom DRAM foundry

• intended to be usedWuxi wafer fabproduction lines, improve the utilization rate of old lines and reduce the dependence of local design companies on external parties.

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5. Marvell acquires Celestial AI: laying out optical interconnection

• Acquired photon interconnection companies to strengthenAI data center all-optical connectionstrategy

• The goal is to create the most comprehensiveHigh bandwidth, low power consumption, low latencyOptical interconnection solutions

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6. Zhuosheng Micro: Comprehensive layout of 6-inch filters

• Complete6-inch SAW filterFull category coverage, large-scale mass production of duplexers/quadplexers/six-plexers

• DiFEM, L-PAMiD and other integrated modules are introduced to brand customers, and L‑PAMiD enters mass production delivery

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7. Ankaiwei plans to acquire 85.79% of Sichuan Technology’s shares

• transaction consideration326 million yuan, expandUltra-low power consumption IoT chipbusiness

• Collaboratively covering IoT scenarios such as smart wearables, smart homes, and industrial instruments