WsxMall > Industry Information > [Core Information] Memory Prices Continue To Rise, And The Two Giants’ DRAM Growth In The Fourth Quarter Exceeds Expectations

[Core Information] Memory Prices Continue To Rise, And The Two Giants’ DRAM Growth In The Fourth Quarter Exceeds Expectations

WsxMall 2026-03-25 14:22:52 2 Related Key Words: [Core Information] Memory prices continue to rise and the two giants’ DRAM growth in the fourth quarter exceeds expectations

Memory prices continue to rise, Samsung and SK Hynix’s DRAM growth in the fourth quarter exceeds expectations
Driven by strong demand for AI, the DRAM market has entered a super cycle, with South Korea's two major memory giants Samsung and SK Hynix becoming core beneficiaries.Due to the surge in orders for high value-added DRAM products and traditional DRAM, the DRAM average selling price (ASP) of the two companies in the fourth quarter of 2025 will increase far beyond initial expectations.
This tight supply and demand covers all categories, not just high-end products: mainstream suppliers have tilted most of their DRAM production capacity to HBM, significantly reducing the supply of general-purpose products such as DDR4, resulting in a widening supply and demand gap for general-purpose DRAM used in PCs and mobile phones, and a simultaneous surge in prices.
Specifically, Samsung's DRAM ASP in the fourth quarter is expected to rise to the upper ten digits quarter-on-quarter, higher than the mid-teens estimated in the third quarter financial report meeting; SK Hynix's DRAM ASP in the fourth quarter is expected to rise to the high single digits quarter-on-quarter.Faced with tight supply, companies such as Xiaomi and Alibaba have adopted strategies to ensure supply at all costs and accepted price increases of more than 50% higher than the previous quarter.
2. Changxin Memory comprehensively displays the latest DDR5 and LPDDR5X products for the first time
On November 23, 2025, at the 22nd China International Semiconductor Expo (IC China), Changxin Memory, with the theme of dual-core resonance and full power of 5, comprehensively demonstrated the latest results of the two major product lines of DDR5 and LPDDR5X for the first time, further improving the high-end storage product matrix.
Among them, the latest DDR5 product series has a maximum speed of 8000Mbps and a maximum particle capacity of 24Gb. It has simultaneously launched seven major modules and new products including UDIMM, SODIMM, and CUDIMM, covering all scenarios such as servers, workstations, and personal computers, accurately matching high-end needs in various fields.As the largest and most technologically advanced IDM company in China and the only IDM company to achieve large-scale mass production of general-purpose DRAM, the DDR5 products released by Changxin Memory can be widely used in high-performance computing, artificial intelligence, data centers and other fields with the advantages of higher transmission rates and lower power consumption.
The LPDDR5X products exhibited on the same stage focus on flagship models in the mobile market, with a maximum speed of 10667Mbps and a maximum particle capacity of 16Gb, covering a variety of capacity packaging solutions such as 12GB, 16GB, 24GB, 32GB, etc., to meet the high performance and low power consumption requirements of mobile terminals.
This dual-line breakthrough will further enrich the global supply of memory chips and provide diverse choices for downstream customers. Changxin Memory will also continue to deepen its technological iteration and lead the collaborative upgrading of the industrial ecosystem.
3. SK Hynix plans to expand DRAM production and target AI applications
In order to meet the urgent needs of cloud service providers and core customers such as NVIDIA and AMD, SK Hynix plans to expand DRAM production capacity by more than 8 times by 2026, with the expansion focused on the Icheon production base in South Korea.The monthly output of 1c DRAM wafers at the base will be significantly increased from the current 20,000 wafers to 140,000 wafers. At the same time, other production bases will be expanded to fully increase the scale of production capacity.
4. STMicroelectronics launches 18nm STM32V8 series MCU
STMicroelectronics (ST) officially launches a new generation of high-performance MCU - STM32V8 series. This product is the world's first MCU based on 18nm process. It is equipped with embedded phase change memory (PCM) and powerful Cortex-M85 core, and has the industry's smallest non-volatile memory unit.
It is worth noting that STMicroelectronics and its partner Huahong Grace (HHGrace) plan to start mass production and delivery of this product this quarter. The first batch of STM32 completely made in China will be delivered to customers one after another. Its compatibility and quality are completely consistent with products produced in other regions around the world, which will accelerate the popularity of STM32 in the Chinese market.
5. Chengdu Huawei: 4-channel 12-bit ADC completed customer verification and received intended order
Chengdu Huawei disclosed on the interactive platform that the company's new products released this year have received positive market feedback, including 40G RF direct-sampling ADC (such as HWD12B40GA4), heterogeneous PSoC and other chips. With their internationally leading performance and independent full-process technology advantages, they have been widely used.It is suitable for key fields such as electronics, communications, control, and measurement, and perfectly matches the core requirements of high integration, low power consumption, and low latency downstream. It has been verified by many customers and has outstanding performance in signal processing speed, stability, and compatibility. In some scenarios, it has been replaced by similar foreign products.
6. Tianyue Advanced: Has launched a full range of 12-inch substrates, suitable for advanced GPU packaging
In response to industry news that Nvidia plans to use 12-inch silicon carbide substrates in new generation GPU advanced packaging starting from 2027, Tianyue Advanced stated on the interactive platform that it has paid attention to relevant developments.It is reported that 12-inch silicon carbide, as a package interposer material, can significantly improve heat dissipation efficiency, increase integration density, while reducing package size and cost.

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[Core Information] Memory Prices Continue To Rise, And The Two Giants’ DRAM Growth In The Fourth Quarter Exceeds Expectations

Memory prices continue to rise, Samsung and SK Hynix’s DRAM growth in the fourth quarter exceeds expectations

2. Changxin Memory comprehensively displays the latest DDR5 and LPDDR5X products for the first time

3. SK Hynix plans to expand DRAM production and target AI applications

4. STMicroelectronics launches 18nm STM32V8 series MCU

5. Chengdu Huawei: 4-channel 12-bit ADC completed customer verification and received intended order

6. Tianyue Advanced: Has launched a full range of 12-inch substrates, suitable for advanced GPU packaging

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