AI computing power infrastructure entersBoth volume and price riseStage: TI data center business will usher in50%+outbreak, the global distribution leader's revenue has strengthened across the board; storage-end HBM4 mass production, AI SSD accelerated landing, eSIM domestic commercialization accelerated, the semiconductor industry chainAI driven + domestic replacementThe double main lines are clear.
1. TI: Data center business becomes growth engine, analog chips welcome recovery
1. Core judgment
- TI CEO: Data center business will usher inAbout 50% strong growth, returning to the peak demand in 2022, is the fastest track for analog chip recovery.
- Communications business recovers simultaneously, driven by AI computing infrastructurePower management, signal chain, hot swapDemand for analog chips surges
2. Performance and Trends
- Data center business in 2025YoY + 64%, reaching US$1.5 billion, accounting for 9% of total revenue, growing for 7 consecutive quarters
- Benefit from AI serversHigh power consumption, high densitydemand, TI analog chips arePower management, cooling controlThe field has become a necessity
- Market expectations: TI willSplit the data center business separately, highlighting strategic position
2. Distribution leaders: Wenye and Dalianda have strong revenue and AI-driven growth
1. Wenye Technology (August 2025)
- revenue: NT$100.1 billion,Year-on-year + 23%, month-on-month + 7%, the second highest in history
- cumulative: NT$700.9 billion from January to August,Year-on-year + 14.3%
- Driver:AI server, data centerStrong demand, industrial/automotive market recovery
2. Dalianda Holdings (August 2025)
- revenue: NT$78.82 billion (approximately NT$18.78 billion),Month-on-month + 3%, year-on-year - 7.1%, a record high for the same period last year
- cumulative: NT$654.66 billion from January to August,Year-on-year + 20.5%
- Driver:AI server, power supply, storageIterative demand, boosted by consumer electronics peak season
3. Breakthroughs in storage technology: HBM4 mass production, AI SSD accelerated implementation
1. SK Hynix: The world’s first to complete the development and mass production of HBM4
- Core parameters: 2048 I/O channels (double),Bandwidth ×2, energy efficiency + 40%, speed10Gbps+(Exceeds JEDEC 8Gbps standard)
- Technology:AdoptMR-MUF4With 10nm level process, mass production risks are controllable
- Application: Adapted to new generation AI accelerators such as NVIDIA GB200/300 and AMD MI400
2. Kioxia × NVIDIA: AI SSD speeds up R&D and replaces HBM
- target:Commercial use in 2027,Read 100 times faster(up to100 million IOPS)
- Architecture:Direct GPU(Bypass CPU), supportPCIe 7.0, double disk synergy reaches200 million IOPS
- Positioning:asFlexible memory expansion layer, substitute30%-50%HBM demand, alleviating HBM supply constraints
- Forecast:202950% NANDWill be used in AI-related industries
4. Domestic eSIM: Micro-mass production by Unisoc, AI+5G integration layout
- status: The first domestic company to realizeeSIM global commercial useof chip vendors
- Products: Mass production of multiple models in line withGSMA and domestic communication standardseSIM chip
- Layout: CompleteAI+5G+eSIMIntegrated scene technology reserve and stocking
- Commercial: Overseas mobile phone eSIM shipmentsBreaking tens of millions, full access to the three major domestic operators
5. Summary of core trends
- AI-driven analog chip resurgence:TI data center business50%+Growth, driving power, hot-swap, signal chain, etc.Analog chip volume and price rise
- Distribution channels are booming: Wenye and Dalianda’s revenue grew stronger.AI server, storageas core growth engine
- Storage technology iteration accelerates: HBM4 mass production, AI SSD research and development,HBM+SSDCollaboratively supports AI computing power
- Domestic substitution deepens: eSIM accelerates commercialization in simulation, storage and other fieldsDomestic alternatives continue to open up