[Core Information] ST Launches SPC58 Core With 20-Year Supply Guarantee, TI Launches New Hall Effect Switch

1. ST: The supply guarantee of SPC58 automotive-grade MCU has been extended to 20 years, locking in the long-term solution for smart cars

1. Core Commitments

• The SPC58 seriesLong-term supply plan extended from 15 to 20 years, make sure to2038Continuous supply
• SPC58 H series(up to 10MB NVM) supplied to2041, covering the entire life cycle of the body/gateway
• rely onIn-house IDM manufacturing, the whole process is independently controllable to ensure the stability of the supply chain

2. Product matrix and application

• 5 universal product lines: Intelligent gateway, body control (lighting/door lock), communication/analog/security peripherals
• 2 high-performance product lines (E/N Series): Powertrain electrification, chassis safety, and support for complex motor control
• IntegrateHSM Hardware Security Module, compliant with EVITA Medium to ensure vehicle network security

3. Industry significance

• Automotive MCUMaximum guaranteed period, reducing platform development risks and BOM iteration costs for car companies
• supportIntelligent electric vehicle 8–15 year life cycleDesigned to match OTA and functional safety requirements
• Consolidate ST inBody/chassis/power domainThe MCU’s leading position

2. TI: TMAG5134 planar Hall switch, 1mT sensitivity + 0.6µA power consumption

1. Core parameters and technology

• Sensitivity: DetectionAs low as 1mTMagnetic field, the industry’s highest in-plane Hall switch
• Power consumption: average0.6µA, significantly extending battery life
• technology: Integratedmagnetic concentratorAmplify signal without high current bias
• encapsulation: SOT-23, X1LGA (1.3×0.9mm), supports push-pull/open-drain output
• temperature: -40℃ to +125℃, covering all industrial/consumption scenarios

2. Core advantages

• Replacement for TMR/AMR/reed switches: Lower cost, higher reliability, no mechanical wear and tear
• In-plane sensing: Detect magnetic field parallel to PCB, more flexible design
• 300mm wafer manufacturing: Large-scale mass production, outstanding cost performance

3. Typical applications

• Door and window sensors, laptop/mobile phone opening and closing detection, home appliance status sensing, industrial limit sensing

3. Nexperia: AEC-Q100 multiplexer, automotive grade memory expansion

1. Product specifications

• NMUX27518-Q100:6 channel 2:1 bidirectional multiplexer,AEC-Q100 Grade 1
• Voltage: 1.08V–3.63V, industry-leading wide voltage range
• encapsulation: TSSOP24 (4.4mm), HWQFN24 (4×4×0.75mm, 0.5mm pitch)
• temperature: -40℃ to +125℃, meeting the harsh environment of vehicle regulations

2. Core applications

• ADAS domain controller, vehicle host, T-BOX: Expand memory through qSPI to improve computing power and storage
• Consumer/enterprise level: notebook, server audio and video signal routing

4. Storage and sensors: domestic breakthroughs + high-end iterations

1. SK Hynix: ZUFS 4.1 mobile NAND, empowering device-side AI

• The world's first mass productionZUFS 4.1(Partitioned UFS), already used in flagship phones
• supportData partition storage, optimizing end-side AI model loading and inference efficiency
• Customer verification completed in June and mass production in July to enhance the mobile AI experience

2. Smartway: 50 million pixels 0.7μm mobile phone CMOS, domestic high-end auxiliary camera

• SC535XS: 50 million pixels, 0.7μm pixels,28+nm Stack process
• carryPixGain HDR、SFCPixel-SL、AllPix ADAF, high dynamic, low noise, fast focus
• PositioningDomestic high-end flagship auxiliary camera(Telephoto/Wide Angle), improve video shooting capabilities

3. Chengdu Huawei: 105 million yuan high-speed and high-precision ADC order

• Sign with customer105 million yuanADC Procurement Framework Agreement, 2024 Revenue17.39%
• Logo domesticHigh speed and high precision ADCAchieve large-scale breakthroughs in the industrial/communication fields

4. Osun Semiconductor: 8-inch MEMS IDM project put into production

• total investment3.5 billion yuan, integrating R&D/design/manufacturing/packaging and testing/application
• construction8-inch MEMS mass production line, rapid R&D line, automotive grade reliability center
• fill domesticHigh-end MEMS sensorsIDM capacity blank

5. Terminal Market: Domestic brands of high-end mobile phones lead the growth rate

CounterPoint 2025 first half data

• Global$600 + high-end phoneSales volumeYoY + 8%, a record high (overall market +4%)
• apple: share62%, growth rate3%(Constantly ranked first)
• Samsung: share20%, growth rate7%
• Huawei: share8%, growth rate **>24%**
• Xiaomi: Growth rate55%, share rapidly increased
• Google: Growth rate105%, the base is lower

6. Summary of core trends

1. Automotive electronics: long-term supply guaranteed as standard
   • ST SPC58 20-year guaranteeSet an industry benchmark and enter the automotive MCU marketLong cycle, high reliabilityera
   • Anshi, Osong, etc. accelerateAutomotive grade devicesLayout, domestic substitution penetrates from consumption to automobiles
2. Sensing and Simulation: Low Power Consumption + Highly Sensitive Focus
   • TI TMAG5134 with1mT+0.6µARedefining position sensing, TMR/AMR replaces acceleration
   • Chengdu HuaweiADC orders exceed 100 million, domestic analog/mixed signal chips enterLarge-scale commercial use
3. Storage and imaging: AI drives premiumization
   • SK hynixZUFS 4.1, Sweetway50 million pixel CMOS, supportOn-device AIand image upgrade
   • Mobile phone high-end marketDomestic brands lead the growth rate, Huawei and Xiaomi’s share increased rapidly
4. Manufacturing and IDM: Accelerating the implementation of domestic production capacity
   • Ozon8-inch MEMS IDMPut into production, Smartway, Chengdu Huawei, etc.Design + ManufacturingCollaborate to improve the domestic semiconductor ecosystem