Chip layout, new game: International original manufacturers collectively bet on 12-inch + localization to reconstruct the global chip competition landscape

1. Production capacity revolution: global original manufacturers are collectively rushing towards 12 inches, and costs have dropped by another 40%

1. Texas Instruments TI: A $60 billion bet on seven 12-inch factories, IDM’s ultimate scale

• strategy: Seven new 300mm (12-inch) wafer fabs were built in the United States, with a total investment of over$60 billion
• Advantages: unit cost reduction40%, the production capacity of a single factory is increased2.3 times
• target: Realized by 203095% independent production capacity, firmly controls analog + embedded chip supply
• Progress: The Texas SM1 factory has been completed and will be put into production in 2025
• logic：Only IDM+12-inch can support the long-term, high-volume, and high-consistency requirements of analog chips.

2. NXP: Closing 4 8-inch factories and transitioning to 12-inch hybrid model

• action: Shut down 4 8-inch factories and concentrate resources on 12-inch production lines in Singapore and Austin
• Collaboration: VSMC Singapore 12-inch joint venture with UMC, mass production in 2027
• Cover: 40nm–130nm automotive grade MCU, power, RF chip
• Effect: The utilization rate has been greatly improved, and the unit cost has also been reduced.40%
• mode: Flexible combination of self-owned production capacity + outsourced manufacturing, adaptable to software-defined automobiles and industrial automation

2. China’s battlefield: localized manufacturing + ecological binding, fighting for control of the high-end market

1. STMicroelectronics ST: Huahong manufactures MCUs locally and launches new products in China

• manufacturing: Achieved in Huahong by the end of 202540nm eNVM MCU local mass production, workmanship/quality consistent with Europe
• Products: Intensive release of STM32 new product matrix in June
  • STM32C0: Cost-effective entry-level model
  • STM32U3: ultra-low power consumption
  • STM32MP23: Edge AI/Industrial
  • STM32WBA6: multi-protocol wireless
• target: regain the share toLocal production capacity + cost performance + ecologySuppress domestic MCU

2. Infineon: All mainstream products will be localized in 2027, focusing on automotive and AI

• planning: Realize MCU, power devices, sensors in 2027All lines locally produced
• focus: 28nm TC4x automotive grade MCU completes front-end + back-end manufacturing in China
• base:Wuxi factory automation rate in 202670%, personnel efficiency increased by 40%
• track: Focus on new energy vehicles, renewable energy, AI data centers and other high-growth areas

3. Industry core conclusions

1. 12 inches becomes standard

   The exit of 8-inch production capacity is accelerating, and 12-inch bringscost, scale, qualityTriple advantages are the bottom line for future competition.
2. Supply chain regionalization is irreversible

   International giants no longer just sell into China;Made in China, for China, for the world, local manufacturing = delivery security + price advantage + customer binding.
3. Car regulations + AI + industry are the core of the competition

   All production capacity and localization are centered on high-margin, long-cycle tracks, and consumer electronics continues to be marginalized.
4. Pressure on domestic chips intensifies

   For international original factory use12-inch cost reduction + fast local deliveryFace the challenge head-on, and domestic substitutes will enter from filling the gap.High-end head-to-headstage.