Automotive SerDes chips: Smart cars are high-speed arteries, and domestic substitution is making a full breakthrough
SerDes are smart carsCamera, radar, large screen, domain controlThe high-speed data artery between them directly determines the bandwidth, latency and reliability of smart driving and cockpits.The market is currently highly monopolized by TI and ADI, but withRuifake, Naxinwei, Kangzhi, Shouzhuanwei, HaoweiDomestic manufacturers represented byOpen standards, cost advantages, and independence throughout the industry chainRapidly catching up has become the core breakthrough for domestic substitution of automotive semiconductors.
1. What is SerDes?Why is it indispensable for cars?
SerDes = Serializer + Deserializer
- Convert multiple parallel data into high-speed serial signals to achieveLong distance, low interference, less wirestransmission
- Key technologies: PLL, CDR clock recovery, LVDS, equalization, FEC error correction, 8B/10B encoding, etc.
Three major demand scenarios
ADAS autonomous driving8 million pixel camera bandwidth ≈ 5.75Gbps
L4 needs to transmit 12+ channels of high-definition video at the same time,
Only SerDes can carry Smart cockpit multi-screen linkageCentral control + instrument + HUD three-screen total bandwidth requirement >50Gbps
Far more than LVDS (≈3Gbps), traditional Ethernet (1Gbps)
In-vehicle real-time communicationEnd-to-end latency is nanoseconds, supporting V2X, lidar, and domain control high-speed interconnection
Bicycle usage
- L2/L3: 8–16 serializers + 2–4 deserializers
- L4 and above:>20 pieces
- Rate: Mainstream 6–8Gbps, towards12.8Gbps / 24Gbps(PAM4)Upgrade
2. Market structure: TI + ADI have a total monopoly of 92%, and domestic products are accelerating to break through.
International giant (private agreement + ecological binding)
- TI(FPD-Link)Global share ≈ 60%, strong cockpit screen, supports 8K, 16Gbps
- ADI (GMSL, formerly Maxim)Share≈32%, ADAS camera fieldMarket share exceeds 90%
- Inova (APIX), ROHM, Sony (GVIF), NXP (acquisition of Aviva)
Features:Closed protocol, high patent barriers, must be used in conjunction with the same brand
Domestic manufacturers (open standards + cost advantages + full independence)
- Norelsys: HSMT standard, top three in domestic market share, cumulative shipments >4 million units
- Nanocore Micro: HSMT 6.4Gbps, FEC + retransmission, stronger anti-interference
- Kangzhi Technology (AIM): HDL protocol, vehicle certification, supply to Changan and SAIC
- First introduction of microelectronics:Dual protocol (HSMT + MIPI A-PHY), breaking brand binding
- Yu Taiwei: MIPI A-PHY route, 6.4Gbps Estimated samples by the end of 2025
- OmniVision Group: 2Gbps OTX9211/9342 has been designated, and 6Gbps products will be launched in Q3
3. Core advantages of domestic substitution
Standards brokenHSMT (China industry standard) + MIPI A-PHY + ASA open protocol popularization
Dual-protocol chips can interoperate across brands and are no longer locked by TI/ADI.
Significantly lower costsDomestic products are cheaper than imported products
30%–50%, faster delivery and more flexible service
Entire industry chain independenceDesign + wafer foundry + packaging and testing are all domestically produced, and the supply chain is safe and controllable
Howell and other CIS manufacturers have joined together to form a camera + SerDes combination solution
Strong support from car companiesDomestic smart driving and cockpit penetration rates lead the world, and car companies are willing to give domestic manufacturers the opportunity to get on board.
In 2025, the annual domestic automotive SerDes demand is expected to reach
300 million pieces
4. Future trends and window period
- 2025–2027 YesKey window period for domestic production
- speed direction12.8Gbps、24GbpsUpgrade, high-end market reshuffled
- Open protocols (HSMT/A-PHY) will continue to squeeze the share of private protocols
- Institutional forecast:The share of domestic automotive SerDes is expected to exceed 30% in 2030
5. Summary
Automotive SerDes are smart carsThe most rigid and the highest growth rateOne of the latest analog/high-speed interface chips, the market has been monopolized by overseas giants for a long time.now inPolicy support, open standards, cost advantages, collaboration between car companies, and independence of the entire industry chainDriven by multiple drivers, domestic manufacturers are making rapid breakthroughs from low-end to high-end, from back-to-front assembly, and from single-chip to platform-based solutions. They are expected to achieve large-scale replacement in the next two to three years and become an important benchmark for the localization of automotive semiconductors.