[Core Information] New Rules For Chip Origin Certification, Stmicroelectronics Reshapes Its Layout

[Core Information] New rules for chip origin certification, STMicroelectronics reshapes its layout

1. China Semiconductor Manufacturing Association clarifies the identification of semiconductor "origin":The place of production is the place of origin

• core rules: According to Order No. 122 of the General Administration of Customs, pressPrinciples for changing the four-digit tariff numberidentified.Since the tax number of IC (tariff code 8542) remains unchanged from wafer to finished product, the "strip-out place" is the place of origin **.
• Declaration requirements: Regardless of whether it is packaged or not, import customs declaration shall be based onThe location of the wafer tape-out factoryshall prevail and have the PO certificate ready for verification.
• influence: Directly affects tariff accounting, trade statistics and supply chain compliance. Enterprises need to adjust customs declaration and labeling information (such as distinguishing COD / tape-out place, COA / packaging place).

2. STMicroelectronics’ (ST) global reshaping:Betting on 300mm and SiC, laying off 2,800 people in three years

• Capacity focus
  • French Crolles(300mm): core of digital products, expanded to14,000 tablets/week。
  • Italian Agrate(300mm): Intelligent power flagship, expanded to4000 tablets/week。
  • Italy Catania: Power Semiconductor/SiC Center,200mm SiC production line Q4 2025 put into production。
  • singapore: Focus on high-volume production of mature processes; optimize and adjust other European factories.
• cost optimization
  • introduceAI and automation, improve R&D and manufacturing efficiency.
  • voluntary separation plan: Global by 2027Up to 2800 people, focusing on the transformation of traditional jobs.
• strategic direction: Go all out300mm silicon waferwith200mm silicon carbide (SiC)production capacity to meet automotive and industrial needs.

3. SEMI: Global Semiconductor Equipment in 2024$117.1 billion，Mainland China leads the way

• Total scale：$117.1 billion(+10% year-on-year), a record high.
• Regional pattern (top three)：
  1. Mainland China：$49.6 billion(+35%), accounting for global42%, ranked first.
  2. South Korea: $20.5 billion (+3%), driven by storage and HBM.
  3. Taiwan, China: $16.6 billion (-16%), capacity expansion slowed.
• Segment growthSEMI：
  • front end: Wafer processing equipment + 9%, benefiting from advanced logic and HBM production expansion.
  • backend: Packaging and testing equipment rebounded strongly (packaging + 25%/testing + 20%), and demand for AI and advanced packaging exploded.

4. TSMC Kumamoto Factory IIDelay in starting construction, resources shifted to the United States

• original plan: Construction will start in Q1 of 2025, mass production in 2027 (6/7nm).
• new developments: Postponed towithin 2025Construction has started, and the production time is temporarily maintained at the end of 2027.
• main reason：
  • strategic tilt: Priority is given to ensuring the construction of the Arizona plant in the United States.
  • weak demand: Demand for automotive chips in Japan is sluggish, and customers’ investment intentions are shifting to the United States.
  • Infrastructure issues: Local traffic congestion triggered protests by residents.

5. Haowei releasedThe first domestic one-inchFlagship sensor OV50X

• Core parameters：50 million pixels, 1-inch outsole, 1.6μm pixels。
• core technology：
  • TheiaCel:Single exposure implementation110dB HDR, no artifacts, high frame rate.
  • PureCel Plus-S: Stacking technology, excellent low light performance.
  • QPD full pixel focusing: Focusing is faster and more accurate.
• Progress: Sample has been produced,Q3 2025 mass production, Huawei Pura 80 series is expected to be launched.
  

  Howe OV50X image sensor

Summary of core highlights

1. Tightening of compliance: IC Origin CertificationTap-out place, corporate customs declarations need to be adjusted immediately.
2. Capacity differentiation: ST bets on SiC and advanced processes; TSMCSlow and urgent, the geographical influence intensifies.
3. market recovery: Equipment sales hit a new high,Mainland ChinaBecome an absolute engine, AI and HBM drive growth.
4. Domestic breakthrough：OV50XMarks the official entry of domestic imaging chipsone inchFlagship era.