[Core News] Infineon acquires Marvell’s automotive Ethernet business, Samsung flash memory and memory transmission prices increase

1. Infineon acquires Marvell’s automotive Ethernet business for US$2.5 billion in all cash

• acquirer：Infineon
• Target: Marvell Automotive Ethernet Business (Brightlane™ Product Line)
• Amount：$2.5 billion(all cash)
• Progress: The agreement was signed on April 7, 2025, and the delivery was completed in August.
• merge into：InfineonAutomotive Division

• Product complementarity: Completing the shortcomings of Infineon’s automotive high-speed communications to formMCU + EthernetFull stack solution, supportSoftware Defined Vehicle (SDV)
• Customer resources:overwrite50+ car companies, including among the world’s top 10 OEMs8 homes
• financial expectations: Estimated revenue in 2025US$225–250 million, gross profit margin is about60%
• strategic extension: Technology can be expanded tohumanoid robotetc.

• Infineon: Strengthen its leading position in automotive semiconductors and increase its focus on intelligent networking and central computing platforms
• Marvell: Strip away the non-core and focus onData Center AI Chip(75% of total revenue)
  

2. Storage market: Samsung takes the lead in raising prices, and the industry enters an upward cycle

• Increase for global major customersDRAM、NAND、HBMprice, range3%–5%
• expected2025–2026Prices continue to rise, mainly due toAI-driven demand surges

• DDR5: Price ratio **+12%** (high performance/enterprise level)
• NAND flash memory: Rising for 3 consecutive months, month-on-month **+9.6%**
• DDR4: Stable for 4 consecutive months, brewing for rebound

• Micron: Q2 DRAM contract price **+10%–12%** (first in price increase)
• SK hynix: Synchronously follow up to control production capacity and raise prices

• demand burst: AI server, HBM, high-end mobile phone/PC pull
• supply contraction:Original manufacturers reduce DDR4/DDR3 production and shift production capacityHBM、DDR5
• Inventory low: Global storage inventories fell to3–4 weeks(Emergency level)

3. Rumors of TSMC × Intel joint venture foundry: promoted by the United States, but questioned by the industry

• Both parties intend toJoint venture operationIntel US Fab
• TSMC isTechnology shares 20%, Intel/U.S.80%
• Goal: Introducing TSMC3nm/2nm, mass production in 2026
• attractQualcomm, Nvidia, AppleWaiting for order

• Technical incompatibility: Intel and TSMC have huge differences in manufacturing processes/equipment/processes
• High integration costs:Production line transformation or super$30 billion
• culture clash: IDM and OEM model management and rhythm are very different

• Chairman of TSMCWei ZhejiaAt the April 17 financial report meetingDenyJoint venture/technology licensing discussion
• TSMC's Arizona plant in the United States has begun mass production and plans to30% advanced production capacityLanded in the United States

4. Tariff impact: Terminals are cautious in stocking up, and demand for storage channels has weakened

• Terminal wait and see: Mobile phone/PC/TV manufacturers assess the impact of tariffs,Low willingness to stock up
• price transmission:Tariffs raise terminal costs, weaken competitiveness, and inhibit upstream stocking.
• market sentiment: Channel prices are high, inventory is sufficient, and customersPlace orders with caution, worried about the market outlook

5. Silan Micro SiC project: 6-inch full production, 8-inch Q4 line

• Capacity：Monthly output 9000 piecesSiC MOS chip
• Vehicle regulations verification: Ⅱ generation SiC-MOSFET driver moduleCumulative shipments: 50,000 pieces(4 car companies)
• Technology iteration: The fourth generation planar gate SiC-MOSFET has been developed, and its performance is close to that of trench gates.

• Progress：mini line-to-line, Ⅱ generation chipThe trial tape-out was successful and the yield rate was better than 6 inches.
• construction: The main factory building is undergoing purification and renovation
• mass production：Comprehensive trial production in Q4, 2025
• scale:Total investment12 billion yuan, annual output after reaching capacity720,000 pieces

Quick overview of core highlights

1. Automotive semiconductors: Infineon completes automotive Ethernet,SDV full stack capabilitiesShaping.
2. storage period：Samsung / Micron / Hynixcollective price increase, AI and HBM drivenstructural bull market。
3. advanced manufacturing: TSMC expands production in the United States, Intel joint ventureThe rumor was denied, geopolitical reshaping of production capacity layout.
4. Domestic SiC：silanwei6→8 inchesAcross, mass shipments according to car specifications,third generation semiconductorAccelerate autonomy.
5. trade risk: Tariff escalation curbs demand,Supply chain regionalization and localizationAccelerate.