Xiaomi SU7 Ultra: The power of electronic components behind smart driving
As a high-end performance electric flagship, Xiaomi SU7 Ultra’s leading intelligent driving experience is essentially
Top-notch chips, multi-mode sensors, AI algorithms and high-reliability devicesThe product of deep collaboration.From perception, decision-making to execution, full-link electronic components jointly build the technical base of the Xiaomi HAD end-to-end intelligent driving system.
1. Intelligent driving core: computing chip (decision-making brain)
1. Dual NVIDIA Orin-X smart driving chips
- Specifications:Dual-chip parallel,Total computing power 508TOPS
- Craftsmanship: 8nm, AI NPU parallel computing architecture
- function: Process massive data from lidar, cameras, and millimeter-wave radar in real time, run end-to-end large models and BEV perception algorithms, and achieve5cm-level positioning, 210-meter long-range detection, and millisecond-level decision-making in complex road conditions
- Highlights: Dual-chip redundant design ensures safety in extreme scenarios.
2. Qualcomm Snapdragon 8295 cockpit chip
- Craftsmanship:5nm
- Computing power:GPU floating point900GFLOPS
- Ability: driverFive-screen linkage, 3K central control, 25-speaker Dolby Atmos, supports HyperOS car-machine smooth interaction in all scenes and AI voice assistant
2. Perception system: multi-mode sensor (intelligent facial features)
1. Hesai AT128 lidar (1 piece)
- Number of lines: 128 lines
- Detection distance: 210 meters (10% reflectivity)
- Function: 3D space modeling, stable perception at night/rain and fog, accurate distance measurement of obstacles
2. HD camera (11 pcs)
- Specifications: 8 million pixels, global shutter
- Distribution: Full coverage of front view, surround view, side view and rear view
- function: Lane lines/traffic lights/pedestrians/vehicle recognition, visual SLAM, parking precise positioning
3. 4D millimeter wave radar (1 pc) + ultrasonic radar (12 pcs)
- 4D millimeter wave: 77GHz, measuring distance/speed/altitude/azimuth, all-weather anti-interference
- Ultrasound: Near-field blind spot detection, low-speed parking and collision avoidance
4. Sub-meter level high-precision positioning
- Integrated navigation (GNSS+IMU), positioning accuracy **<1 meter**, tunnel/underground garage continuous positioningXiaomi car
3. Power supply and power devices (power heart)
1. Full SiC silicon carbide power module
- supplier:Infineon / Zhanxin Electronics
- Application:Three electric systems (motor controller, OBC, DC-DC)
- Advantages: 800V high voltage platform,Switching losses reduced by 70%, improved efficiency, reduced heat dissipation, and supports 480kW ultra-fast charging
2. ASIL-D level power management chip
- Function: 132 power supply node management and control, collisionCut off high voltage extremely quickly in 0.02 seconds, the safety level reaches the highest level of vehicle regulations
4. Software and AI collaboration (soul of the system)
- Xiaomi HAD end-to-end system: Driving/parking/remote summoning 18 functions, supporting urban NOA, highway NOA, and unprotected intersection trafficXiaomi car
- XLA smart driving architecture: BEV+Transformer large model, multi-sensor deep fusion, dynamic path planning
- HyperOS 1.5.5: OTA continues to upgrade smart driving capabilities and open up car-home-mobile phone full-scenario smart linkageXiaomi car
5. Core Values and Industrial Significance
- hardware ceiling: 128-line lidar + dual Orin-X+8295,500,000-level intelligent driving hardware benchmark
- Domestic supply chain collaboration: Hesai lidar, Lianchuang Electronics/OFILM camera, Inovance Technology electric drive, CATL battery,A model for mass production of local high-end devices
- technology trends:Chip + sensor + AI large modelDeep integration has become the core of smart electric vehicle competition and accelerated the localization of automotive-grade semiconductors.
Xiaomi SU7 Ultra starts withTop electronic components + full stack self-developed algorithm, proving that China’s high-end smart electric vehicles have become globally competitive, and also bring large-scale implementation opportunities to industrial chains such as semiconductors, sensors, and power devices.