[Core News] Microchip and ON Semiconductor initiate layoffs, Infineon sells 8-inch fab

1. Microchip cuts 2,000 jobs (9%) in response to slowing demand for automotive chips

• Scale of layoffs: approx.2000 people, accounting for global employees9%
• Influence area: Back-end factories in Oregon, Colorado, and the Philippines in the United States
• Capacity adjustment: Early closure of the Arizona wafer fab (originally planned for September 2025, now completed in May)
• cost target: annual savings$90 million–$100 million; one-time feeUS$30 million–40 million
• background: Q3 revenue of fiscal year 2025 year-on-year **-41.9%**, weak automotive/industrial demand and high inventory

2. Infineon sells its 8-inch factory in Austin, USA (Fab 25) to SkyWater

• Target：Austin, Texas200mm (8 inches) Fab 25
• transaction：SkyWater acquires and operates OEM,65nm/BCD/ high voltageCraftsmanship
• employees: near1000 peopleAll employees transferred to SkyWater
• progress:2025June 30Complete delivery
• strategy: Infineon focuses on high-margin vehicle specifications/power and outsources mature process production capacity

3. ON Semiconductor plans to lay off 2,400 employees (9%) in 2025

• scale:Global layoffs2400 people(about 9%)
• cost: DisposableUS$50 million–60 million
• annual savings：US$105 million–115 million
• scope: All departments, focusing on automotive/industrial/AI power supplies, shrinking non-core businesses

4. San’an-ST Chongqing 8-inch SiC project officially launched

• total investment：23 billion yuan
• Progress: Opened in February 2025,Q4 mass production
• Capacity: full production10,000 tablets/week(480,000 pieces/year)
• Positioning: The first domestic article8-inch automotive grade SiC power deviceMass production line
• Supporting: Chongqing Sanan 8-inch SiC substrate (7 billion yuan) has been put into production in September 2024

5. Silan Micro Xiamen 8-inch SiC production line (Phase 1) capped

• total investment：12 billion yuan(7 billion for the first phase)
• Progress: Construction will start in June 2024 → topping out in February 2025Hangzhou Silan Microelectronics Co., Ltd.
• planning: The line will be put into operation at the end of 2025 and put into production in 2026Q1.
• Capacity: one issue420,000 pieces/year(35,000 pieces/month)
• Products: SiC MOSFET, used in new energy vehicles, photovoltaics, and AI server power supplies

6. Micron G9 process UFS 4.1/3.1 starts shipping

• Craftsmanship: The world’s firstG9 3D NAND UFS 4.1/3.1
• Performance: Sequential read and write **>4.1GB/s**Micron Technology
• Capacity：256GB–1TB
• Application: Flagship mobile phone, folding screen, device-side AI
• Follow-up: LPDDR5X (1y process) will be launched in early 2026

7. Nvidia/Broadcom/AMD evaluate Intel 18A process

• Customer: Nvidia, Broadcom, AMD test Intel18A (2nm level)
• technology：RibbonFET (GAA) + PowerVia (backside powered)Intel
• progress: Broadcom/Nvidia sent for testing; AMD under evaluation
• disagreement: Some manufacturers believe thatYield/mass productionStill not enough
• Positioning: Intel OEM counterattacks key nodes to compete for AI/HPC orders

Industry Trend Summary

1. Automobile chip cycle downturn：Microchip, ON Semiconductor, Infineon GroupLayoffs/sell factory/shrink production, in response to slowing demand and high inventories.
2. 8 inches differentiated:Silicon-based mature processExit/Sell；8-inch SiC(San'an/Yifa, Shilanwei)Explosive expansion of production。
3. Domestic substitution accelerates: Chongqing and Xiamen8-inch SiCWith the implementation of the project, the independent supply capability of automotive-grade power devices has been improved.
4. AI computing power main line: Micron G9, Intel 18A, Broadcom/Nvidia are all bettingAI storage/advanced process。