[Core News] Infineon promotes localized production and ON Semiconductor expands silicon carbide layout

1. Infineon: Deepen localized production in China and get closer to local customers

Infineon CEO said that it is accelerating progressChina localized productionstrategy in response to strong demand from Chinese customers for local manufacturing of key components.It plans to transfer some products to Chinese foundries and make full use of its own back-end factory in Wuxi to strengthen its supply chain and market response capabilities.

Infineon logo

2. ON Semiconductor: Acquired Qorvo SiC JFET business for US$115 million to strengthen power devices

• Technology reinforcement: SiC JFET hasVery low on-resistance, can significantly improve power efficiency and perfectly complement ON Semiconductor’s EliteSiC product matrixonsemi。
• Market focus: Focus on satisfyingAI data centerpower supply,electric carBattery disconnect device andIndustrial solid state circuit breaker(SSCBs) high efficiency and high power density requirementsonsemi。
• Progress: Transaction estimate2025 Q1Done.
  

  ON Semiconductor logo

3. Huahong Wuxi: The second phase of the 12-inch project has been put into production, focusing on automotive-grade chips.

• Positioning: focusAutomotive grade chipmanufacturingHuahong Group。
• scale:Monthly production capacity83,000 pieces12-inch special process production lineHuahong Group。
• Highlights: The project is smaller than the original plan100 days in advanceCompleted, it will significantly ease the pressure on domestic automotive-grade chip production capacityHuahong Group。

4. STMicroelectronics: Releases flagship STM32N6 with built-in self-developed NPU

• core performance: equipped with800MHzCortex-M55 core,4.2MBLarge capacity RAMSTMicroelectronics。
• AI computing power：Integrated self-researchNeural-ART NPU, computing power reaches0.6 TOPS, which is the current top-level STM32600 times。
• Application scenarios: forIndustrial vision, smart audio, smart homeEqui-edge AI scenariosSTMicroelectronics。
  

  STM32N6

5. Marvell: Launches the world’s first 3nm 1.6T PAM4 interconnection platform Ara

• Core advantages: Integrated200GbpsSerDes can reduce the power consumption of 1.6T optical moduleReduce more than 20%Marvell Technology, Inc.。
• strategic value: Designed forAI servers and data centersDesigned to provide ultra-high bandwidth and energy efficiency to support the next generation AI computing network.
• Progress：2025 Q1Send samplesMarvell Technology, Inc.。
  

  Marvell Ara 3nm 1.6T PAM4 chip

6. Industry recovery: AI and memory drive Q3 semiconductor market growth 17%

• core motivation：AI chipWith the explosion of demand for high-performance memory (HBM/DDR5).
• Head performance：
  • Samsung: With memory recovery, it returned to the top of the list, with a year-on-year **+18%**.
  • NVIDIA: Demand for AI chips has skyrocketed, and revenue has increased **+94%** year-on-year.
  • SK Hynix / Micron: HBM has strong demand and its revenue is **+94%/+93%** year-on-year respectively.
    

7. Technological breakthrough: Samsung completes development of 400-layer NAND flash memory

• Industry status: Leading technology and mass production321st floorSK Hynix for NAND.
• Mass production plan:PlanISSCC 2025Publish technical details,Second half of 2025mass production.
• Capacity planning: Simultaneously upgrade the Xi'an factory and convert the 128-layer (V6) production line to the **236-layer (V8)** process.
  

8. Samsung OEM: The new leader sets the tone, focusing on advanced and mature manufacturing processes.

• Advanced process: The first task is to overcome2nmCraftsmanshipYield ramp。
• Mature process: Emphasis on its commercial value and willExpand production capacity and compete for customers, achieving dual-track progress.