[Core News] TSMC’s 2nm yield rate reaches over 60%, and mass production will begin next year
1. TSMC’s 2nm yield rate exceeds 60% and will be mass produced in 2025
TSMC’s 2nm process has been put into trial production at its Hsinchu factory.
Yield exceeds 60%, planning to enter large-scale mass production in 2025, leading the world's competitors.
The target yield rate needs to be increased to
70%+, Apple iPhone 18 A20 chip will be launched in 2nm and adopt SoIC packaging. Nvidia and AMD are also core customers.
2. NXP × World's most advanced Singapore 300mm wafer fab starts construction
VSMC 12-inch wafer fab, a joint venture between NXP and World Advanced Technology, officially started construction.
Trial production in 2027, full production of 55,000 pieces/month in 2029。
The factory adopts full automation + AI quality management to build a Singapore smart wafer factory, focusing on automotive and industrial chips.
3. 2024 Q3 Global wafer foundry revenue hits record high, with SMIC firmly ranked third
TrendForce data: Q3 total revenue of the world’s top ten foundries$34.9 billion, +9.1% month-on-month, a record high.
- TSMC: nearly 10% share65%, ranked first
- Samsung: Share9.3%, second
- SMIC: firmly ranked third
- Capacity utilization rates of UMC, GLOBALFOUNDRIES, Huahong, and World Advanced have simultaneously recovered
4. Innolux FOPLP advanced packaging mass production postponed to first half of 2025
accept
Technology learning curve + weak mobile phone market, PMIC packaging order adjustmentDue to the impact, FOPLP mass production has been postponed from the end of 2024.
Innolux is expanding into non-mobile phone applications and remains optimistic about the prospects of fan-out panel-level packaging in the long term.
5. STMicroelectronics will supply SiC devices to Renault Ampere starting in 2026
ST signs contract with Renault's electric vehicle brand Ampere to start supply in 2026Silicon carbide power module, used in 400V/800V platform inverters to improve battery life and fast charging performance.
6. Broadcom releases 3.5D F2F package, which Fujitsu 2nm processor will use
Broadcom launches industry's first
3.5D XDSiP packaging platform, a single package integrates over 6000mm² silicon and 12 HBM stacks, oriented towards AI computing power.
Fujitsu 2nm Arm processor
MONAKAThis technology will be used and mass production will begin in February 2026.
7. Shengbang Micro releases 16-bit 8-channel DAC chip SGM71622R8
New product is
8-channel, 16-bit, SPI interface, built-in referenceDAC, for optical modules, PLC, industrial automation, instrumentation.
Single channel power consumption is only
0.5mA, power saving mode as low as
0.5μA, working temperature - 40℃~125℃, suitable for harsh industrial environments.
$1.3/ 个
BOM
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