[Core Information] Microchip closes wafer fab to reduce costs, Kioxia cuts flash memory production to support prices
1. Microchip closes 8-inch wafer fab and lowers quarterly performance guidance
Affected by high inventory and weak demand, MCU manufacturer Microchip announcedClosure of Tempe Fab 2 fab in the United States(8 inches, monthly production capacity 20,000 pieces), expectedCompleted closure in Q3 2025, which can save approximately$90 millioncash flow.
- Revenue for Q2 FY2025 (as of end-September)$1.164 billion, year-on-yearDropped 48.4%, down 6.2% month-on-month
- Lowers Q3 revenue forecast toApproximately $1.025 billion, approaching the lower limit of previous guidance
- Previously, the backlog of inventory has been digested through employee vacations and production capacity control.
2. Kioxia plans to reduce NAND production in December, hoping to stabilize flash memory prices
TrendForce predicts that NAND flash memory prices will continue to weaken in Q4, with consumer-side destocking leading to weak orders.
- Kioxia ProjectNAND flash production cut in December, to ease supply pressure and promote prices to stop falling and rebound.
- Driven by AI server16TB+ Enterprise SSDDemand continues to improve, supporting the market outlook
- Leading manufacturers such as Samsung are also likely to reduce production simultaneously to jointly maintain price stability.
3. Marvell’s data center business nearly doubled, with total revenue increasing 19% month-on-month
Marvell’s Q3 performance for fiscal year 2025 (as of November 2) is obviously divided:
- total revenue$1.516 billion, year-on-year + 6.9%, month-on-month + 19%
- Data center revenue $1.1 billion, year-on-yearSkyrocketed 98%, AI computing power demand is strong
- Consumer, operator, enterprise network, automotive/industrial businesses all declined year-on-year
- Q4 revenue is expected to increase by another 19% month-on-month and +26% year-on-year, returning to the growth track
4. Denso + Fuji Electric received Japanese subsidies and invested a total of more than 200 billion yen to expand SiC production capacity
Japan's Ministry of Economy, Trade and Industry approved Denso and Fuji ElectricSiC power semiconductor production expansion plan：
- total investment211.6 billion yen, the highest government subsidy70.5 billion yen
- New annual production capacity310,000 piecesSiC related production capacity, available from May 2027
- Fuji Electric increases SiC epitaxy and power devices; Denso invests in building SiC wafer and epitaxial production lines
5. NVIDIA GB200 mass production encounters obstacles, Microsoft cuts orders by 40%
GB200 dueConnector yield is not up to standard, mass production may be postponed toMarch 2025：
- Supplier Amphenol backplane connector test does not meet mass production requirements
- Microsoft cuts GB200 orders by **40%**, shifting some to GB300 mid-next year
- NVIDIA is working with the supply chain to urgently solve technical bottlenecks
6. Rockchip micro-device side AI chip is launched, covering multi-scenario intelligent hardware
Provided by Rockchip0.2–6TOPsComputing power series chips, RK3588/RK3576 equipped with 6TOPs NPU:
- support0.5B–3B parametersClient-side large model deployment
- It has been used in batches in terminal products such as AI learning machines, dictionary pens, smart speakers, and conference hosts.
7. Montage Technology’s clock chip enters mass production preparation stage
The first batch of Montage TechnologyProgrammable clock generatorLaunched and currently inMass production preparation stage：
- Clock chips have a high degree of overseas monopoly, with TI, Renesas, and Microchip occupying the mainstream
- The company plans to improve its product matrix and promote clock chipsOne-stop domestic replacement
$1.3/ 个
BOM
+86 4000004090
Online WhatsApp