[Core News] AI drives Marvell chip prices to rise, Nvidia GB200 orders surge

1. Price increases for Marvell’s entire product line, effective in early 2025

• time: From January 1, 2025Price increases across the board
• Reason: AI demand surges and supply chain investment costs rise
• growth engine: 800G PAM, 400ZR and other optical communication products,Data center revenue increased by more than 90% year-on-year
• market impact: The field of optical communications took the lead in raising prices, and the stock price rose in response.

2. Microsoft’s GB200 orders surged 3-4 times, and Nvidia’s production capacity expanded significantly

• largest customer: Microsoft for the worldMax GB200 buyer
• surge in orders:Q4 orders from 300-500 cabinets→1400-1500 cabinet(70% for NVL72),Up to 400% increase
• Capacity planning：
  • 2024 Q4：150,000-200,000 pieces
  • 2025 Q1：500,000-550,000 pieces(increase 200%-250%)
• Performance: GB200 has better inference performance than H2001.5x improvement

3. NAND flash memory Q4 price reduction, mobile products most obvious

• Whole:Contract priceQuarterly decrease of 3%-8%
• Consumer SSD：5%-10% reduction(AI PC demand is lower than expected)
• Enterprise SSD：Slight increase 0%-5%
• Mobile eMMC/UFS：The largest drop was 13%.(Mobile phone market is weak)

4. SK Hynix’s strategy focuses on HBM and reduces CIS business

• core steering: Resource concentrationHBM and AI storage(high profit)
• CIS business: R&D investment reduction,Cut production capacity in halfto <7000 pieces/month
• Manpower adjustment：SoC design department staffGo to HBM department
• HBM progress: HBM3E mass production, 12-layer products available in Q4,HBM will account for 40% of DRAM revenue

5. Blackwell shipments are delayed, Nvidia and TSMC are in dispute

• question: Chips are used in the high-pressure environment of data centersAbnormal operation, low yield
• Accusations from both sides：
  • NVIDIA: TSMC ** new packaging technology (CoWoS-L) ** unstable
  • TSMC: NVIDIAWorking too hard, insufficient time to deal with the problem
• Follow-up: Huang Jenxun clarified100% NVIDIA design flaws, has been fixed, and will start shipping in Q4
  

6. NXP launches S32J automotive Ethernet switch

• Core parameters：80GbpsBandwidth, 10Mb-10Gb ports,Dual Cortex-R52
• safe：ASIL-D, Hardware Security Engine (HSE), MACsec, TSN
• ecology: Shares the NETC core with S32 MCU/processor and adapts to the CoreRide platform
• time:Virtual development kitend of 2024, mass production2025
  

7. Renesas releases two IO-Link chips to empower industrial automation

1. CCE4511 (four-channel main chip)

• Industry’s first 4-channel IO-Link master, single channel500mAdriveRenesas
• Advantages：Energy saving, PCB area saving, fewer external components, temperature resistance **-40℃~125℃**Renesas
  

2. ZSSC3286-IO (dual-channel sensor conditioning)

• Integrated IO-Link protocol stack，Replacement MCU, reduce costs and save space
• Accuracy: double24-bit ADC, high-precision signal amplification and correction