Welcome to WsxMall | Register
BOM
WsxMall > Industry Information > [Core News] TSMC’S Revenue Increased By Nearly 40% Year-On-Year, Intel And AMD Jointly Promote The X86 Ecosystem

[Core News] TSMC’S Revenue Increased By Nearly 40% Year-On-Year, Intel And AMD Jointly Promote The X86 Ecosystem

[Core News] TSMC’s revenue increased by nearly 40% year-on-year, Intel and AMD jointly promote the x86 ecosystem


1. TSMC’s Q3 revenue increased by nearly 40% year-on-year, with advanced processes accounting for 69%

  • Revenue:NT$759.69 billion (approximately US$23.5 billion), +39% year-on-year, +12.8% month-on-month
  • Net profit: NT$325.26 billion,Year-on-year + 54.2%
  • Advanced process share:7nm and below total 69%
    • 3nm:20%
    • 5nm:32%
    • 7nm:17%

2. Intel + AMD join forces to establish x86 Ecosystem Advisory Group

  • Members: Intel, AMD, Microsoft, Google, Broadcom, Dell, Lenovo, Red Hat, etc.
  • Goal: Unify the instruction set and architecture interface to improveCompatibility and consistency
  • Covering: data center, cloud, PC, edge, embedded all scenarios

3. ASML Q3 revenue increased by 12% year-on-year, EUV orders are solid

  • Net sales:7.467 billion euros, +12% year-on-year
  • Gross profit margin: 50.8%
  • New orders: 2.6 billion euros, of whichEUV 1.4 billion euros
  • Q4 outlook: revenue of 8.8 to 9.2 billion euros, gross profit margin 49% to 50%

4. Q2 global server market output value increased by 35% year-on-year

  • Market size:US$45.422 billion, +35% year-on-year
  • AI server proportion: 29%
  • Top three: AMD, Dell, HP

5. Q3 global smartphone sales increased by 2% year-on-year, turning positive for the first time in six years

  • +2% year-on-year, ending consecutive years of decline
  • Ranking: Samsung (19%) > Apple (16%) > Xiaomi (14%) > OPPO/vivo (9% each)
  • Highlights: Huawei, MotorolaYear-on-year growth of nearly 30%

6. Microchip releases 20 Wi-Fi chips to strengthen industrial and IoT connections

  • New products: PIC32MZ-W1 Wi-Fi MCU, WINCS02/WILCS02 controller, RNWF02 cloud connection module
  • Features: Pin compatible, high GPIO, strong security, simplified cloud access
  • Targeted at: AIoT, industrial automation, digital manufacturing


Hot -selling model

Product Index :