[Core Information] Vishay officially announces factory reorganization, Micron NAND flash memory revenue hits record high
1. Vishay launches global factory reorganization, closes factories, lays off employees and reduces costs
Vishay Technology (Vishay) announced its restructuring plan to
Closing three manufacturing plants and laying off about 800 people: Including Shanghai diode packaging factory, German resistor factory, and American resistor factory.
The production transfer will start in Q4 of 2025 and be fully completed by the end of 2026; the restructuring cost will be approximately US$38 million to US$42 million. After implementation, annual cost savings will exceed US$23 million, optimizing the global production capacity layout of passive components and discrete devices.
2. Micron’s financial report rebounded significantly, and NAND revenue exceeded US$1 billion in a single quarter.
Micron’s full-year fiscal 2024 revenueUS$25.111 billion, a year-on-year increase of over 60%, successfully turning losses into profits.
- Q4 revenue, gross profit margin, and net profit continued to improve quarter-on-quarter;
- The demand for AI computing power drives the rapid growth of data center DRAM and HBM;
- Data center SSD is strongly driven,NAND revenue exceeds $1 billion in single quarter for first timerecord high;
- Optimistic about fiscal year 2025, revenue and profitability are expected to hit new highs.
3. GigaDevice Innovation launches GD32A7 series of high-performance automotive MCUs
New GD32A7 automotive grade MCU equipped
Cortex-M7 core, clocked at 160MHz, providing single-core/dual-core/single-core lock-step multiple architectures.
It meets the AEC-Q100 Grade1 automotive standard, operates in a wide temperature range of -40℃~+125℃, supports seamless OTA, multi-channel CAN FD/LIN, and industrial Ethernet TSN/AVB, and is widely adapted to body control, vehicle interconnection, and chassis systems, strengthening the competitiveness of domestic vehicle chips.
4. Sirip releases high-precision BMS chip TPB76016
Serip's 17-channel battery management chip TPB76016 integrates multiple protections for voltage, current and temperature, has built-in balanced MOS and secondary fuse driver, and operates stably in a wide temperature range.
Adapted to power batteries, energy storage batteries, and consumer lithium battery BMS solutions, it has high integration and streamlined peripherals, helping to localize new energy battery management.
5. SK Hynix takes the lead in mass production of 12-layer stacked HBM3E in the world
SK hynix realizes
12-layer HBM3E mass production, with a single capacity of 36GB, a 50% increase in capacity compared to the 8-layer version;
Through chip thinning, TSV stacking, MR-MUF5 advanced technology, and optimization of heat dissipation and warpage control, we ensure a stable supply of AI high-bandwidth memory and consolidate our leading position in high-end HBM technology.
6. Infineon expands OptiMOS 6 power MOSFET matrix
The newly added 135V/150V high-voltage OptiMOS 6 series has reduced on-resistance by 50%, optimized FOM index by 20%, and significantly reduced body diode reverse recovery loss compared with the previous generation.
It is suitable for industrial drives and high-frequency switching power supplies, taking into account high efficiency, high power density and EMI performance, and has complete packaging specifications.
7. ST releases fourth-generation SiC MOSFET platform, focusing on automotive inverter
STMicroelectronics launches
Fourth generation silicon carbide technology platform, focusing on optimizing the traction inverter scenario of new energy vehicles.
The 750V specification has been certified, and the 1200V version is expected to be launched in Q1 of 2025, comprehensively improving the energy efficiency and durability of high-voltage silicon carbide devices and accelerating the penetration rate of automotive SiC.
8. Creative Electronics 3nm HBM3E IP landing application
Creative Electronics' 3nm process HBM3E controller and PHY IP are adopted by leading cloud vendors and high-performance computing customers, supporting 9.2Gbps rates.
The full-process, full-CoWoS packaging solution has completed tape-out verification and is compatible with mainstream HBM original manufacturers. It simultaneously lays out the next-generation HBM4 IP and is deeply integrated with TSMC’s advanced process ecosystem.
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