APSME 2025 Asia International Power Semiconductor, Materials and Equipment Technology Exhibition

1. Exhibition background

2. Basic information

• Exhibition name：APSME 2025 Asia International Power Semiconductor, Materials and Equipment Technology Exhibition
• Holding time: November 20-22, 2025
• Venue：Guangzhou Poly World Trade Expo Center
• Organizer: Shenzhen Xinxinneng Exhibition Co., Ltd., Guangzhou Harvest Watson Exhibition Co., Ltd. (United Semiconductor Industry Organization)
• Exhibition scale:Planned area20000㎡, expected300Global exhibitors and **10000+** professional visitors attended the conference

3. Scope of core exhibits

1. Power devices: IGBT, MOSFET, power IC, diode, transistor, etc.;
2. third generation semiconductor materials: Silicon carbide (SiC), gallium nitride (GaN), zinc oxide (ZnO), diamond and other wide bandgap materials;
3. Manufacturing equipment and parts: Single crystal furnace, photolithography machine, etching machine, ion implantation equipment, die bonding machine, bonding machine, testing machine, etc.;
4. Design and development: EDA, IP design, embedded software, IDM/Fabless solutions;
5. Package testing: Screen printing, vacuum reflow soldering, X-RAY inspection, laser marking, power terminal bonding, etc.;
6. Thermal management: Thermal interface materials, graphene, high thermal conductivity packaging materials (Al/Cu/Mo), phase change thermal storage materials, TEC thermoelectric refrigeration devices, etc.

4. Professional audience lineup

• Semiconductor manufacturers: Huawei, BYD Semiconductor, STMicroelectronics, Infineon, ROHM Semiconductor, Silan Microelectronics, China Resources Microelectronics, Core Energy, Penjie, etc.;
• Terminal applications: Xpeng Motors, FAW Hongqi, Guangzhou Automobile Group, CATL, Sungrow, Inovance Technology, Midea, etc.

5. Concurrent technical forum

• Automotive Grade Power Semiconductor Forum
• Power Semiconductor IGBT/SiC Industry Forum
• Compound Semiconductor Technology and Application Development Forum
• GaN gallium nitride power device technology forum
• Si Silicon/SiC Silicon Carbide Power MOSFET Technology Forum
• Silicon carbide substrate material growth and processing technology innovation forum
• The Third Generation Semiconductor Material Manufacturing and Equipment Technology Summit Forum
• Power Semiconductor Device Performance Development and Testing Technology Forum

6. Exhibition value

• Help upstream material/equipment manufacturers expand their markets and connect with high-quality customers;
• Provide technology display and brand promotion windows for midstream device/module companies;
• Empower downstream terminal companies such as new energy vehicles, photovoltaics, and industrial control to reduce costs, increase efficiency, and upgrade supply chains;
• Promote the deep integration of industry, academia and research, and accelerate the implementation and localization of third-generation semiconductor technology.