[Core News] TSMC expands packaging and testing capacity, Qualcomm’s acquisition of Intel attracts attention

1. 1. TSMC urgently expanded the factory after buying it

• While delivering the factory area, urgently place factory affairs and equipment super urgent orders, targetFirst half of 2025Put into production and contribute CoWoS advanced packaging production capacity.
• fight hardCoWoS total production capacity doubled in 2025, to alleviate the current severe shortage of supply.

• Production capacity planning: The monthly production capacity will be approximately 35,000 pieces by the end of 2024, reaching 70,000 pieces by the end of 2025, and further increased to 100,000-105,000 pieces by the end of 2026.

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2. Analyst: Qualcomm’s acquisition of Intel will be a disaster if it happens

• limited income: It will only be of short-term help to Qualcomm’s AI PC chip business; however, Microsoft has firmly supported the Arm architecture (Surface uses Qualcomm processors), and Qualcomm’s growth in the PC market is a high probability event, and there is no need for high-priced acquisitions.
• financial stress: Intel’s market capitalization is approx.$93 billion, far exceeding Qualcomm’s cash reserves of approximately US$13 billion; the acquisition will cause the net profit margin to drop from20%+ plummets to single digits or even loses, Intel's loss-making wafer foundry business (IFS) is the biggest liability.
• Difficulty in approval: The transaction scale is huge,Global antitrust review is almost certain to be blocked, cannot be completed in the short term.

• Conclusion: Qualcomm’s acquisition motivation is weak, its internal attitude is conservative, and rumors may be driven by external factors.

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3. Murata develops the first 006003 ultra-small size MLCC

• Application background: Smartphones and other devices have become more high-performance and miniaturized, and the MLCC consumption of a single mobile phone can reach1000, the demand for ultra-small components has surged.

• Time node: On display at CEATEC JAPAN on October 15, 2024,Samples will be provided by the end of the year。

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4. ADI partners with Tata Group to produce semiconductors in India

• Tata Investments:Plan$11 billionConstruction of India's first wafer fab (Gujarat), additional investment$3 billionConstruction of packaging and testing plant (Assam).

• Cooperation direction: Tata Electronics manufactures chips for ADI; Tata Motors and ADI jointly develop on-board energy storage and power electronic components; Tejas Networks collaborates on network infrastructure hardware.

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5. Samsung launches automotive SSD based on eighth-generation V-NAND

• Core advantages: Meets AEC-Q100 Level 2 temperature scale (-40℃ to 105℃), high temperature resistance and high reliability.
• capacity planning: Available in 128GB-2TB versions, where2TB is the maximum capacity of car SSD, mass production is expected in early 2025.
• Mass production progress: The 256GB version has been sent to major car company partners.Mass production by the end of 2024。