[Core Information] Agency: Semiconductor revenue hit a record high in the second quarter, reaching $162.1 billion
1. Global semiconductor Q2 revenue sets new historical record
According to data from market agency Omdia, total global semiconductor revenue in the second quarter of 2024 reached
$162.1 billion, a quarter-on-quarter growth of 6.7%, surpassing the fourth quarter of 2021 and setting a new industry record.
The core driving force for this round of growth comes from
NVIDIADriven by the AI chip business, its single-quarter revenue was US$18 billion more than the historical peak; the industry's overall revenue increased by US$33 billion year-on-year, but the market differentiation was significant, with more than half of the companies' revenue declining year-on-year, and the head concentration effect intensified.
2. Q3 is expected to continue to grow at a high rate, with AI giants firmly at the top of the list
Omdia predicts that in the third quarter of 2024, total global semiconductor revenue will reachUS$175.866 billion, a month-on-month increase of 8.5%.
- Nvidia leads the way with its AI computing chips, with estimated Q3 revenue of US$28.103 billion and a market share of 16.0%;
- Samsung ranked second with semiconductor sales of $21.712 billion;
- SK Hynix surpassed Intel to rank third, benefiting from the increase in HBM and storage prices, and the industry ranking is reshaping.
3. Infineon’s breakthrough: world’s first 300mm gallium nitride wafer technology
Infineon successfully developed
300mm GaN power semiconductor mass production technology, relying on the transformation and reuse of the existing silicon-based 300mm production line, significantly reducing costs.
Compared with traditional 200mm wafers, single chip output increases
2.3 times, production efficiency has been significantly optimized, and the large-scale implementation of high-voltage gallium nitride devices in the automotive, industrial control, and fast charging fields has been accelerated.
4. Samsung’s ninth-generation 1Tb QLC V-NAND officially enters mass production
Samsung officially announced the mass production of its ninth-generation V-NAND 1Tb QLC flash memory, which continues the dual-stack ultra-high-level digital architecture and increases the bit density by 86% compared to the previous generation.
Comprehensive performance upgrade: writing speed doubled, IO transmission speed increased by 60%, read and write power consumption reduced by 30% and 50% respectively; covering consumer electronics, PC, server SSD and cloud data center storage scenarios.
5. NXP releases highly integrated automotive-grade BMS monitoring chip MC33777
MC33777 is the world's first single-chip BMS junction box IC that integrates a full set of core functions at the battery pack level, replacing traditional multiple discrete solutions.
Simplify design, certification and software development costs for car companies, improve battery management accuracy and vehicle safety, optimize battery life performance, and improve NXP's vehicle electrification product matrix.
6. STMicroelectronics launches FIPS 140-3 authoritative certification TPM
ST releases the first batch of approved products in the industry
FIPS 140-3Cryptographically secure certified STSAFE Series TPM Trusted Platform Modules.
The products cover high-security scenarios such as PCs, servers, industrial equipment, medical care, and automotive regulations. The hardware meets AEC-Q100 and long-term industrial-grade application requirements, and strengthens the underlying security protection of terminal data and hardware.
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