2024 Munich South China Electronics Production Equipment Exhibition|Pre-registration is in full swing and will kick off in Shenzhen in October
2024 South China International Intelligent Manufacturing, Advanced Electronics and Laser Technology Expo (LEAP Expo) core exhibition——Munich South China Electronic Production Equipment Exhibition, officially finalizedOctober 14th -16th, landed at the Shenzhen International Convention and Exhibition Center (Baoan New Hall), focusing on the entire electronic intelligent manufacturing industry chain to create a highly influential event for equipment, materials, process technology exchanges and procurement docking in South China.
This exhibition closely follows the trend of industrial upgrading, focusing on key links in the entire process of electronic manufacturing, with exhibits coveringAutomation and motion control, test and measurement instruments, SMT surface mounting, dispensing and chemical materials, wire harness processing equipment, semiconductor packaging manufacturing, Mini LED complete line productionand other core areas, connect upstream and downstream supply and demand, focus on the conversion of old and new driving forces, and build a professional and integrated electronic and smart manufacturing business exchange platform.
Free pre-registration is open, real-name reservations are available for efficient exhibition viewing
The exhibition has fully opened the online pre-registration channel, and visitors can completeReal-name authentication + online appointment, you can achieve quick entry without queuing on site, save viewing time, efficiently connect exhibitor resources, and lock admission to industry events with one click.
Five new special areas, focusing on innovation in subdivided tracks
This exhibition has newly upgraded the layout of the exhibition area and created five major theme areas to accurately match the rigid needs of the industry:
- Automation and Robot Intelligent Manufacturing Exhibition Area
- Smart factory and micro-assembly technology park
- TGV Glass Substrate Advanced Materials and Manufacturing Exhibition Area
- New energy vehicle wire harness processing and manufacturing exhibition area
- Mini LED packaging production line display area
With segmented scenarios as the core, cutting-edge solutions for cost reduction, efficiency improvement, flexible production, and precision manufacturing will be demonstrated to help enterprises iterate technology and upgrade production capacity.
Multiple high-end forums were held simultaneously to explore the future of the industry
The exhibition will be accompanied by a number of high-profile industry summits and technology forums, bringing together industry luminaries, technical experts and business representatives to provide in-depth interpretations of industry trends:
- AI + Operation Control + Robotics and Automotive Electronics Intelligent Manufacturing Innovation Application Conference
- Mini LED Advanced Manufacturing Industry Summit Forum
- New Energy Vehicle Wiring Harness and Connector Innovation Technology Forum
- Semiconductor and high-end electronic glue innovation forum
Focusing on popular tracks such as automotive electronics, semiconductor packaging, new displays, and industrial automation, we will share cutting-edge technologies, implementation cases, and industry policies to empower companies to seize new market opportunities.
October 14-16
Shenzhen International Convention and Exhibition Center (Baoan)
Scan the QR code to pre-register now and gather at the South China Intelligent Manufacturing Expo to explore new business opportunities in electronics manufacturing.