List of concurrent forums at the 2024 Munich South China Electronic Production Equipment Exhibition
2024 South China International Intelligent Manufacturing, Advanced Electronics and Laser Technology Expo (LEAP Expo)Munich South China Electronic Production Equipment Exhibition, will beOctober 14-16Held at **Shenzhen International Convention and Exhibition Center (Baoan New Hall)**.During the same period, it focused on the entire electronic intelligent manufacturing industry chain and opened 4 high-quality professional forums, covering the four hot areas of AI + robots, Mini LED, new energy vehicle wiring harnesses, electronic dispensing and adhesives, bringing together elites from industry, academia and research to explore technology trends and practical applications.
1 AI + Operation Control + Robotics and Automotive Electronics Intelligent Manufacturing Innovation Application Conference
core focus: The integration of AI, motion control, and robotics technologies empowers the intelligent manufacturing and upgrading of automotive electronics.
meeting background
AI, operation control and robotics technologies are reshaping intelligent manufacturing of automotive electronics to meet high-precision, high-efficiency, and high-reliability production needs.The conference brings together industry experts, business leaders and academic elites to discuss technology trends, industry challenges and application prospects.
2024 Topic Outline
- The integration of collaborative robots and electronic intelligent manufacturing: the pioneering force of intelligent transformation
- Operation control technology - the future engine of new energy automotive electronics
- Digitalization + low carbonization, two-wheel driving electronics to create a smart future
- New energy vehicle electronic drive system solutions
- AGV + Manipulator Composite Robot Empowers New Business Formats in the Industry
- AI empowers electronics manufacturing and leads industry innovation
2 Mini LED Advanced Manufacturing Industry Summit Forum
core focus: Mini/Micro LED industry trends, process technology and key equipment innovation.
meeting background
The global Mini/Micro LED market size is expected to reach US$36 billion in 2028, with a compound growth rate of over 50% in the next five years, and the industry has entered a period of rapid implementation.The forum brings together upstream and downstream enterprises in the industry chain to discuss technical barriers, market prospects and collaborative cooperation.
2024 Topic Outline
- Mini/Micro LED market status and prospect forecast
- Mini/Micro LED core process technology analysis
- AIAOI technology helps the Mini LED industry improve quality and efficiency
- Future development trends of Mip packaging technology
- COB technology breakthrough path and industrialization prospects
- Research progress on key technologies and equipment for mass transfer
3 2024 New Energy Vehicle Wiring Harness and Connector Innovation Technology Forum
core focus: New energy vehicle high-voltage/high-speed wiring harness and connector technology innovation and intelligent solutions.
meeting background
The connectivity and intelligence of new energy vehicles drive the demand for high-frequency and high-speed transmission, and automotive Ethernet and high-voltage wiring harnesses have become the core.High-voltage wire harnesses face severe challenges such as precision manufacturing, high withstand voltage, strong shielding, and waterproofness, and are in urgent need of technological upgrades and intelligent processing solutions.
2024 Topic Outline
- High-speed vehicle Ethernet transmission solutions and development trends
- Automotive Ethernet high-speed transmission cable technology and application
- EMC shielding technology and optimized wiring solutions
- New energy vehicle power system wiring harness/connector design key points
- Automotive high-voltage cable technology evolution and application trends
- Intelligent solution for high-voltage wire harness processing
4 2024 Advanced Electronic Dispensing and Adhesive Technology Forum
core focus: Electronic adhesive innovation, dispensing process upgrade and semiconductor/automotive electronics high-end applications.
meeting background
The global electronic adhesive market size is expected to exceed US$9.2 billion in 2030, with a compound annual growth rate of 8.8%.The demand for precision semiconductor packaging and high reliability in automotive electronics drives the dispensing process to be upgraded to micro-minimization, high precision, and high consistency, and the innovation of materials such as new conductive adhesives and organic silicone gels is accelerating.
2024 Topic Outline
- Innovative applications of new conductive adhesives in 5G/automotive electronics
- Chip-level/board-level packaging high-end electronic adhesive selection and solutions
- Application of silicone adhesives in new energy vehicles/energy storage fields
- Innovative solution for new display (Mini LED/OLED) dispensing process
- Semiconductor packaging low-stress underfill technology trends
- Reliability testing and failure analysis of automotive electronic adhesives
Forum Overview (October 14-16, Baoan, Shenzhen)
| Forum name | core areas | Key points to watch |
|---|
| AI + Operation Control + Robot | Automotive Electronics Intelligent Manufacturing | Siemens, Schneider and other companies share cases of AI visual inspection and digital transformation |
| Mini LED advanced manufacturing | New display | Practical analysis of mass transfer, COB, and Mip packaging technologies |
| New energy vehicle wiring harness | High voltage/high speed connection | Automotive Ethernet and high-voltage wire harness intelligent processing solutions |
| Advanced electronic dispensing and adhesives | Semiconductor/Automotive Electronics | 3M, Sunstar and others share environmentally friendly bonding and low-stress packaging solutions |
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