Industry sources revealed that TSMC plans to increase its sales starting from January 1 next year.3nm, 5nm advanced processQuotation, other processes remain at the original price.Price adjustment details: 3/5nmAI products rose 5%-10%, non-AI products increased by 0%-5%.

The main reason for the price increase is the increase in the use of EUV lithography machines, which has increased the manufacturing costs of single wafers and single chips; flagship chips such as Qualcomm Snapdragon 8 Gen4 and MediaTek Dimensity 9400 all use TSMC's 3nm process, and cost pressure will gradually be transmitted to mobile phone terminal prices.

ON Semiconductor officially completed theSWIR Vision SystemsAcquisition to increase the number of smart sensor product lines.The target company has **CQD colloidal quantum dot short-wave infrared (SWIR)** patented technology, which can expand the detection spectrum range and achieve special penetration imaging.

After the technology is integrated, it will be deeply integrated with ON Semiconductor's existing CMOS sensors to strengthen its competitiveness in high-growth markets such as industrial vision and automotive sensing.

Wafer major GLOBALFOUNDRIES acquires TagoreProduction-grade gallium nitride (GaN) power IPFull portfolio and core engineering team.

As generative AI drives high computing power demands in data centers, GaN has become a core solution for efficient power management; this acquisition enriches GF’s power IP matrix to help customers quickly implement differentiated GaN power products.

Released by Kioxia8th Generation BiCS FLASH3D stacked flash memory, 2Tb QLC version launched and sampling started.Compared with fifth-generation products, the bit density is increased by 2.3 times, and the writing energy efficiency is improved by 70%. A single package can stack 16 chips, with a maximum capacity of 4TB, and the package size is more compact.

The 1Tb QLC version was simultaneously launched, with sequential writing improved by another 30% and read latency optimized by 15%, making it suitable for high-end SSD, mobile devices and AI-related storage scenarios.

Intel official announcementOptane persistent memory 200 seriesProduction is about to be discontinued: new orders will be stopped on December 31, 2024, and supply will be terminated on December 31, 2025.Optane is based on 3D XPoint technology and has both DRAM and NAND features. However, it has continued to suffer losses for a long time, and its business has gradually shrunk and been delisted. This series is compatible with DDR4, has a capacity of 128GB–512GB, and was once targeted at high-end memory scenarios for servers.