[Core Information] ADI’S Revenue Increased By 25% Year-On-Year, And TI Opened A New Wafer Fab

1. ADI’s third fiscal quarter results exploded, with double-digit growth across the market

• core data: Revenue$2.88 billion, year-on-year **+25%; Gross profit margin62.1%(YoY + 5.4pct); operating profit$818 million** (+67% year-over-year).
• growth engine：Industry(accounting for 45%),car、communication、consumer electronicsDouble-digit growth across the board, led by industrial and communications growth.
• Orders and Outlook: The backlog of orders continues to grow, and industrial bookings are strong; growth is expected to continue in the fourth quarter, and the year will end strongly.

2. Texas Instruments Sherman 300mm wafer fab opened, Apple became the first customer

• Project Overview:Total investment$60 billion, the first phase of Sherman’s four new plants, one of seven expansion plans in Texas/Utah;100% renewable energyOperations.
• Customers and Products: Apple is the first batch of customers and produces45–130nmAnalog/embedded chips (unit price approx.$0.4), used for iPhone power management, signal processing and other basic functions.
• strategic significance: Strengthen TI’s capabilities in mature process analog chipsMade locallyand supply stability, helping Apple avoid tariffs and ensure supply chain security.

3. SK Hynix mass-produces 321-layer 2Tb QLC NAND, setting a global record

• technological breakthrough: The world’s first321st floorQLC NAND, single die capacity2Tb(double);six-plane architectureImproved parallel capabilities and write performance **+56%, read+18%, energy efficiency+23%**。
• Apply route: used firstPC SSD, and then expanded toEnterprise eSSD、UFS; Relying on 32-layer stacked packaging, enterAI serverUltra-high capacity storage market.
• Listing plan: Customer verification is in progress, expectedFirst half of 2026Officially entering the AI data center.

4. Howe releases body control SBC solution OKX0330

• Product positioning: Integrated LDO, CAN/LIN, watchdog, high-side switch, benchmarked against German mid-range SBC, supportsASIL‑BFunctional safety.
• Core advantages: Optimized EMC, built-inCAN SIC, saving external common-mode inductors and reducing BOM costs; sample delivery is now open.

5. Jiejie has mass-produced nearly 200 models of micro-car standard MOSFETs.

• Product scale: Already in mass productionMore than 100 styles, optionally close to200 models, continue to iterate.
• Representative products: JMSHO40SAGQ (JSFET, all-copper frame, jumper package), passed vehicle regulations certification, supportingBYD, Honeywelletc. Tier‑1.

6. Tianyue Advanced and Toshiba Electronic Components reach SiC substrate cooperation

• Cooperation content: Technology collaboration improves SiC substrate performance and quality; business cooperation expandsHigh quality and stable supply。
• Application direction: Support Toshiba inRailway, server power supply, vehicleSiC power device development in other fields.

7. Rockchip RV series chip implementation AI glasses project

• Technical advantages: Low power consumption + self-developed ISP, optimizedAI anti-shake, codec, adapted to sports scenesTexas Instruments。
• supply chain strategy: Approximate inventory at the end of the second quarter800 million yuan, due to the long cycle of advanced technology and complex geographies, the implementationStrategic stockingensure safetyTexas Instruments。

8. Yageo raised the purchase price of Shibaura Electronics to 7,130 yen/share

• Acquisition progress: The public acquisition will be launched in May, and the quotation will be made by6635 yenraised to7130 yen, the acquisition period is extended toSeptember 8。
• underlying value:Shibaura for the worldNTC thermistorThe leader, reinforcing Yageo’s layout in the field of high-end sensing of passive components.