[Core Information] TI expands production by 60 billion, AI storage/heat dissipation/imaging breakthroughs, and car regulatory ecology deepens (2025.6.19)

1. Texas Instruments’ $60 billion epic production expansion: 7 300mm factories, focusing on analog/embedded

• total investmentOver $60 billion, the largest basic semiconductor manufacturing investment in U.S. history
• construction7 300mm (12-inch) wafer fabs, distributed in three major bases in Texas and Utah
• createOver 60,000 jobs, capable of producing hundreds of millions of chips every day

1. Sherman, Texas (4 plants)
   • SM1: put into production in 2025 (construction has started for 3 and a half years)Texas Instruments
   • SM2: The construction is completed and the equipment is ready to be installed.
   • SM3/SM4: Under planning, will be advanced based on demand
2. Richardson, Texas
   • RFAB2: The world’s first 300mm analog wafer fab RFAB1 expansion line is gradually reaching full production
3. Lehi, Utah
   • LFAB2: Under construction, LFAB1 will be expanded simultaneously

• full turn12 inches: unit cost reduction40%, production capacity improvement2.3 times
• StrengthenIDM completely homemade: Target 95% independent production capacity, control technology, quality and supply
• Main attackAnalog + Embedded: Covering massive rigid needs in automobiles, industry, and consumer electronics

2. AI storage revolution: Marvell launches 2nm custom SRAM, 6Gb super cache

• Industry first2nm custom SRAM, for AI xPU/data center chips
• Single capacityUp to 6Gb (768MB), record-breaking on-chip cache capacity

• Area saving 15%: Reclaim silicon wafer space to increase computing core/reduce chip size
• Power consumption reduced by 66%: Standby power consumption is greatly optimized to adapt to the low energy consumption requirements of AI clusters.
• Frequency 3.75GHz: High-speed reading and writing, supporting real-time calculation of large models
• Customized architecture: matching AI computing power chip memory wall breakthrough needs

3. Breakthrough in mobile heat dissipation: Nanxin/Awinic piezoelectric liquid cooling driver chip is about to be mass-produced

1. Nanxin SC3601 (190Vpp)

• Voltage: 190V peak-to-peak value, the highest in the industry
• Energy efficiency: Power saving efficiency10 times, standby microamp level
• waveform:THD+N as low as0.3%, sub-millisecond response
• Architecture: Two-way conversion + energy recovery, suitable for mobile phone/AI terminal liquid cooling
• Progress: Under customer verification, mass production is about to begin

2. Awinic 180Vpp solution

• Voltage: 180Vpp, piezoelectric ceramic reverse effect
• Features: Ultra-low power consumption, ultra-small size, ultra-quiet
• Progress:Complete customer verification,2025 Q4 mass production
• Application: High-power terminals such as mobile phones, PCs, and AI glasses

4. High-end imaging: SmartSite SC595XS - 50MP 110dB HDR domestic main camera

• 50 million pixels, 1/1.28-inch outsole, 1.22μm large pixels
• Craftsmanship: 22nm Stack, nationwide supply chain
• HDR: SuperPixGain fusion of three frames in a single exposure,110dB dynamic range（+22dB）
• focus: AllPix ADAF 100% full pixel focus, accurate in low light
• dim light: SFCPixel-2 technology, signal-to-noise ratio **+40%**
• video: 4K 60fps HDR+4K 120fps, power consumption **-30%**
• Progress: Sample delivery in 2025 Q3, aiming at flagship mobile phone main camera

5. Security and independence: Guoxin Technology’s anti-quantum cryptographic card test was successful

• Architecture: Self-developed CCP1080T security chip + domestic FPGA
• algorithm: National secret (SM1/2/3/4) + anti-quantum (Kyber/Dilithium) dual stack
• Performance：Kyber512 decryption1800 times/second, Dilithium2 signature verification600 times/second
• random source: CQWNG10 quantum random number chip, truly random in physics
• Application: High security scenarios such as servers, security gateways, finance/power, etc.
• Progress: Passed internal testing, samples have been sent to customers

6. Automobile Ecology: NXP acquires TTTech Auto, integrating software and hardware to compete for software-defined cars

• The acquisition was completed on June 17,$625 million all cash
• TTTech Auto: Leading vehicle safety middleware, MotionWise launched in mass production

• CoreRide（NXP）+ MotionWise（TTTech）：Integrated software and hardware SDV platform
• solveSoftware and hardware integration barriers, reduce development complexity and improve scalability
• Covering L2+/L3 autonomous driving and accelerating the SDV transformation of car companies
• TTTech remains neutral and supports multi-chip/multi-OEM ecosystem

7. Consumer electronics picks up: PC/tablet double growth in mainland China

• PC (excluding tablet):8.9 million units, year-on-year **+12%**
• Tablet:8.7 million units, year-on-year **+19%**
• Drivers: Subsidy policies stimulate upgrading, and local brands (Huawei/Honor/Xiaomi/SoftStone) increase their share

• PCs flat, tablets **+5%** in 2025
• PC**+6% in 2026, tablet-8%**

8. Industry Summary

1. Capacity pattern: TI’s 60 billion production expansion locks in long-term advantages of analog/embedded, 12-inch becomes mainstream
2. AI technology: Domestic breakthroughs in four major directions: 2nm SRAM, piezoelectric liquid cooling, high-end CMOS, and anti-quantum security
3. Automotive Transformation: NXP’s acquisition fills software shortcomings, and chips + middleware become SDV’s core competitiveness
4. Consumption recovery: PC/tablets are recovering, local brands are rising, cooling/imaging technology upgrades support high-end development