Broadcom Tomahawk 6 and Micron 1γ memory lead: breakthroughs in AI computing power and storage technology (2025.6.5)
In early June, Broadcom and Micron simultaneously released blockbuster new products, setting new industry records in the fields of AI network switching and mobile storage respectively. At the same time, the DRAM market structure has changed, the global semiconductor boom has increased, and AI has become the core driving force throughout the entire industry chain.
1. Broadcom Tomahawk 6: The world’s first 102.4Tbps switch chip, reconstructing the AI cluster network
Broadcom releases a new generation of **Tomahawk 6 (BCM78910 series)** switch chips, specially designed for ultra-large-scale AI clusters, achieving intergenerational leaps in bandwidth, energy efficiency, and AI adaptability.
Core technology breakthrough
- ultimate bandwidth:Single chip switching capacity reaches102.4Tbps, 2 times that of the previous generation (51.2Tbps), and can process 25,000 4K movie data per second.
- Super port density:Supports 64×1.6TbE, 128×800GbE or 256×400GbE ports, compatible with 100G/200G SerDes.
- Advanced process and architecture: Using TSMC3nm（N3E）Processes are heterogeneously integrated with Chiplets, and power consumption per bit is as low as0.35pJ/bit。
- AI-specific optimization (cognitive routing 2.0)
- Million XPU cluster: Supports two-layer Clos architecture and can be connected128,000GPU/XPU, theoretical maximum support1 millionnode.
- Computing power release: Solve network bottlenecks and increase GPU utilization from < 40% to90%+。
- Hardware acceleration: Natively offload AI collective communication such as Allreduce, reducing latency to sub-microseconds.
- CPO co-packaged optics: Integrate optical modules and chips to reduce power consumption by 30% and latency by 100ns, making it suitable for high-density AI data centers.
Industry impact
A single chip can replace 6 previous-generation products, increasing system density by 40% and expected to reduce AI training costs.30%-40%, becoming the core standard configuration of the next generation AI infrastructure.
2. Micron launches 1γ (1-Gamma) LPDDR5X: Mobile AI memory enters the EUV era
Micron launches world’s first
1γ process (sixth generation 10nm level)LPDDR5X memory, first introduced in mobile DRAM
EUV extreme ultraviolet lithography, leading in all aspects of speed, power consumption and size.
Core parameters and advantages
- speed：10.7Gbps(10667MT/s), the fastest in the industry.
- Energy efficiency: Reduced power consumption20%, combined with LVDD2H low-voltage technology, significantly extends the battery life of AI applicationsMicron Technology。
- Ultra-thin package:Thickness only0.61mm, 14% thinner than the previous generation and 6% thinner than competing products, making room for foldable screen/ultra-thin mobile phones.
- process: Micron is the first to adoptEUVMobile memory, integration and stability are greatly improved.
- Capacity: The 16GB version has been sent to customers as samples, and will cover 8GB-32GB in 2026, adapting to next year's flagship models.
Application value
Provide bandwidth support for tasks such as large client-side AI models, real-time translation, and image generation, and improve response speed.25%-50%; and will be extended to areas such as AI PCs and smart cars.
3. Dramatic changes in the DRAM market structure: SK Hynix surpassed Samsung for the first time, Micron grew against the trend
TrendForce data shows that global DRAM revenue in Q1 2025$27.01 billion, month-on-month **-5.5%, butAI HBM becomes the winner**.
Vendor ranking (revenue/market share)
- SK hynix: US$9.72 billion (36.0%),-7.1%
- With HBM3e’s leading edge,Surpassed Samsung for the first timeClimb to the top.
- Samsung: US$9.1 billion (33.7%),-19%
- The design of HBM3e was revised, and shipments of high-priced products plummeted.
- Micron: US$6.58 billion (24.3%),+2.7%
- The only positive growth was the expansion of HBM3e shipments, benefiting from the increase in DDR4 prices.
Market Outlook
PC/mobile phone inventory depletion completed, DRAM shipments and prices starting from Q2Synchronized recovery; DDR4 spot prices have skyrocketed due to the original factory’s suspension of production (Samsung’s EOL at the end of the year)50%+, the price of 16Gb DDR4 exceeds that of DDR5.
4. Global semiconductor boom: WSTS raises forecast, AI drives trillion-dollar market
According to the latest forecast from WSTS (World Semiconductor Trade Statistics), AI and cloud infrastructure will drive rapid growth in the industry.
- 2025:Scale$700.9 billion，+11.2%
- Memory (+28%)、Logic chips (+37%)Two wheel drive.
- 2026:Scale$760.7 billion，+8.5%
- Memory continues to lead the market, while analog and sensors are growing steadily.
5. Other important developments
1. Automotive electronics: ADI establishes OpenGMSL Alliance
Together with more than 20 car companies and Tier1, GMSL serialization and deserialization technology has been designated asAutomotive open standards, reshape autonomous driving, ADAS and infotainment transmission architecture.。
2. Domestic MCU: GigaDevice GD32C231
Launched entry-level products with Cortex-M23 core, integrated ECC error correction, covering home appliances, BMS, and vehicle aftermarket, focusing onSuper cost-effective。
3. Industrial integration: Shangluo Electronics plans to acquire Ligong Technology
Electronics distributor Shangluo Electronics intends to acquire the controlling stake of Ligong Technology in cash to strengthen the coordination of product lines and customer resources.
4. Semiconductor materials: Shanghai Hejing advances 12-inch CIS epitaxial wafer
Accelerate mass production12 inches 55nmCIS (image sensor) epitaxial wafer, Q3 equipment has entered the Zhengzhou factory.
6. Summary and trends
- AI infrastructure finalization: Broadcom Tomahawk 6 defines AI network, Micron 1γ memory empowers end-side AI, and software and hardware collaboration supports the explosion of large models.
- storage cycle reversal: DDR4 has entered a production suspension and price increase cycle, HBM dominates the high-end market, and SK Hynix and Micron benefit from their technology and production capacity advantages.
- Domestic substitution deepens: Continuous breakthroughs in CIS extension, automotive MCU and other fields to complete key links in the industry chain.
- The industry is booming: Driven by AI, the global semiconductor market is acceleratingtrillion dollarsscale.
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