AI power supply revolution, storage price increase, advanced packaging expansion: five core trends in the semiconductor industry (2025.5.22)

1. AI power supply revolution: NVIDIA joins forces with major power manufacturers to accelerate the implementation of 800V HVDC architecture

1. Infineon × NVIDIA: all-material power solution to build power grid to GPU power supply link

• Cooperation core: Development of 800V HVDC central power generation architecture,High voltage direct supply server motherboard, GPU nearby conversion。
• Technical coverage: provideSi/SiC/GaNAll-material power devices, including CoolSiC™ JFETs, high-voltage MOS, and multi-phase controllers.
• key breakthrough：
  • Centralized power supply: Replace distributed PSU, reduce AC/DC conversion by 4 times,Overall energy efficiency + 8%。
  • Hot swap safety:Support 800V busbar online board replacement,Risk of downtime - 90%。
  • Megawatt support: Adapted to 20271MW+AI rack, current dropped by 94%,Copper - 70%。
• timeline: Technology verification in 2025,2027Mass production with Kyber rack.

2. NanoMicro Semiconductor × NVIDIA: GaN+SiC dual technology, locking in high-density conversion

• core program: GaNFast™ (650V GaN) + GeneSiC™ (high voltage SiC) coverage800V bus→rack→GPUFull linkNavitas Semiconductor。
• Performance Highlights：
  • Power density 92.36W/cm³, half load efficiency97.9%, loss **-30%**.
  • Supports Rubin Ultra GPU, 576 in a single cabinet,Total power 1.2MW。
• ecological impact: Navitas U.S. stocks soared after hours200%, A-share HVDC and SiC/GaN sectors strengthened across the board.

3. 800V ecological panorama (officially announced)

• chip: Infineon, Navitas, TI, MPS, ST, ROHM
• power supply: Delta, LITE-ON, Eaton, Schneider, Vitiv
• time：Pilot in 2026, large-scale in 2027

2. Storage reversal: Five major original manufacturers jointly reduce production, and NAND prices start a strong rebound

1. Production reduction alliance and intensity

• Manufacturer: Samsung, SK Hynix, Micron, Kioxia, Western DigitalSynchronized production cuts。
• Amplitude：10%–15%, closing old lines, delaying production expansion, and shifting production capacity to HBM/enterprise level.
• core logic: AI server pullEnterprise SSDoutbreak, consumer supply has shrunk and prices have been restored.

2. Price trend and impact

• Starting from Q2:Contract price **+5%–10%, spot+15%+**。
• second half: TLC/QLC price increases across the board,512Gb–1TbMost in short supply.
• terminal: Prices of SSD, U disk, and mobile phone storage have increased.AI server BOM cost rises。

3. Globalization of advanced packaging: Hon Hai invests 250 million euros to build Europe’s first FOWLP factory

1. Project Overview

• Partners: Hon Hai + French Thales + Radiall.
• Technology：FOWLP fan-out wafer level packaging(the first in Europe).
• investment：250 million euros。
• Customer: Automobile, space, 6G, national defense.
• strategy: European localization, supply chain resilience,High-end advanced packagingGo to sea.

2. FOWLP value

• Thin, light and high performance: High I/O density,Parasitic parameters - 50%, adapted to AI/GPU/car chips.
• Trend: Advanced packaging replaces part of Moore’s Law,2025–2027Demand exploded.

4. OEM price increases: TSMC raises prices for 2nm/4nm, and advanced process costs rise again

1. Price adjustment plan

• 2nm：+10% → US$33,000/piece(all-time high).
• 4nm：10%–30%(AI order top-up 30%, mobile phone 10%).
• Reason: The cost of building a factory in the United States is high,Capital spending in 2025 USD 38-42 billion, AI needs strong bargaining.

2. Impact on the industrial chain

• AI chip: Nvidia/AMD cost rise,The price of computing power rises。
• mobile phone: Flagship SoC cost **+65%** → Terminal price increase.
• Domestic replacement: SMIC N+2, Huahong, etc.Mature/characteristic craftsmanshipExcellent value for money.

5. Domestic high-end: Xiaomi accelerates its self-developed chips and restructures the competitive landscape of mobile phones

1. Xuanjie O1 core positioning

• Craftsmanship：3nm (second generation)、19 billion transistors(Compared to A18 Pro).
• Positioning：Xiaomi high-end flagship only, the world's first echelon of performance.
• Collaboration: Deeply integrated with ThePaper OS and AI,Across mobile phones/carsReuse.

2. Industry impact

• Restructuring the pattern: Domestic manufacturers with self-developed chipsMarket share accelerated, squeezing Apple/Android share.
• Valuation logic：Hardware + OS + ChipFull stack self-research, opening up space for long-term growth.

6. Trend summary: AI computing power infrastructure leads the upgrade of the entire industry chain

1. Power semiconductor: 800V HVDC startOnce in ten yearsreplacement cycle,SiC/GaNmost benefited.
2. storage：NANDProduction reduction + AI demandresonance,2025 second halfPrice increase confirmed.
3. Advanced packaging：FOWLP/CoWoSGlobal expansion, Hon Hai, ASE, and Changdian Technology lead the way.
4. OEM：Advanced processPrice increase + shortage, mature processExcellent value for money。
5. Domestic high-end：Mobile phone/AI chipAccelerate self-research, industrial chainAutonomous and controllabledeepen.