【芯资讯】TI发布全球最小MCU，韩系大厂传出将对闪存涨价

1. TI发布全球最小MCU产品MSPM0C1104，深耕微型化嵌入式场景

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Texas Instruments (TI) recently launched the world's smallest MCU product MSPM0C1104. The product uses a wafer chip scale package (WCSP) and is only 1.38 square millimeters in size, about the size of a black peppercorn. It is 38% smaller than the current smallest competing product in the industry. It can help designers greatly optimize the circuit board space of miniaturized scenarios such as medical wearable devices and personal electronic products without sacrificing performance, and break the space bottleneck in the design of small devices.

This MCU further completes the MSPM0 series product matrix of TI's Arm Cortex-M0+ architecture. It is built based on the 65nm process technology. The core configuration takes into account both performance and practicality: it is equipped with 16KB memory, a three-channel 12-bit analog-to-digital SAR data converter, and is equipped with six universal input/output pins. It is also compatible with standard communication interfaces such as Universal Asynchronous Receiver Transmitter (UART), Serial Peripheral Interface (SPI) and Internal Integrated Circuit (I2C).Its operating power consumption is only 87μA/MHz, standby power consumption is as low as 5μA, and static power consumption can be reduced to as low as 0.65μA. It also supports SRAM data retention, which can ensure the computing performance of embedded systems without increasing the circuit board size.In addition, the MCU also has a built-in buzzer function to further simplify peripheral circuit design, reduce development costs, and is suitable for 1.8-5.5V wide voltage and -40℃-105℃ wide temperature environments, adapting to the needs of more industrial and consumer scenarios.

2. 韩系存储巨头跟进涨价，NAND闪存市场格局生变

According to industry reports, after U.S. memory manufacturers such as Micron and SanDisk announced price increases next month, two major Korean memory giants, Samsung and SK Hynix, also plan to follow up and raise NAND flash memory prices in April, marking the official start of the industry price increase.Among them, SanDisk has made it clear that it will increase NAND prices by more than 10% starting from April 1. The price increase of major Korean manufacturers has not yet been disclosed, but the market impact has attracted much attention.Follow-up market data shows that the NAND flash memory price index rose sharply by 207% in 2025, confirming the continued influence of this price increase.

此次涨价的背后，是原厂减产带来的供需格局调整。三星与SK海力士在2025年第一季度已启动减产措施，全年产量缩减幅度超过10%，有效缓解了此前市场供过于求的失衡状态，推动NAND价格快速触底回升。从市场话语权来看，2024年第四季度三星、SK海力士的NAND市场占有率分别达到33.9%和20.5%，合计占据过半市场份额，影响力远超美光、闪迪，两大巨头的涨价动作预计将快速传导至整个市场，带动NAND闪存价格全面上行。值得注意的是，原厂减产的核心原因之一是将晶圆产能向利润更高的HBM与DDR5转移，导致成熟制程存储供应进一步收紧，为涨价奠定了基础。

3. Phison predicts: Driven by AI, NAND supply and demand will tighten in the second half of the year

According to the Science and Technology Innovation Board Daily, Phison, the global leader in NAND Flash control chips, has released a market outlook. It is expected that the first quarter of 2025 will be the low point of the NAND market for the whole year. With the collective price increase of NAND original manufacturers and the explosion of demand for AI edge devices driven by DeepSeek, the supply and demand pattern of NAND flash memory is expected to become tense in the second half of the year, and the industry prosperity will continue to rebound.This prediction is highly consistent with subsequent market trends. In the second half of 2025, memory chips will officially start a new round of price increase cycles, becoming the core driving force for the performance growth of companies related to the industry chain.

Phison said that the rapid development of the AI industry is reshaping the NAND demand structure. AI servers have much higher storage capacity and performance requirements than ordinary servers. The NAND usage of a single AI server is about three times that of a traditional server. In 2025, AI's demand for storage has reached 40%, and is expected to further increase in the future. This will become the core driving force for tight NAND supply and demand.Based on this, Phison predicts that the company's full-year operating performance in 2025 will be significantly better than that in 2024, seizing opportunities in the storage industry driven by AI.

4. Intel appointed Chen Liwu as its new CEO, and it has become a trend for Chinese to take the helm of global chip giants.

According to fast technology news, Intel has officially appointed Lip-Bu Tan as its next CEO. The semiconductor industry veteran will take over the most challenging position in the chip industry and will officially take office on March 18. This time he will return after leaving Intel's board of directors in August 2024.In a memorandum to Intel employees, Chen Liwu made it clear that he is confident in reversing the company's current business situation and promoting Intel's recovery, focusing on 18A process yield optimization, production capacity improvement, and the coordinated development of data center and AI businesses.

Affected by the news of this personnel change, Intel's stock price reacted positively, rising by more than 11% after the market closed. It closed up 4.6% during the regular trading session that day. The market has high hopes for Chen Liwu's appointment.It is worth noting that with Chen Liwu taking over as Intel CEO, the current four major chip giants in the world - Nvidia, TSMC, Broadcom, and AMD are all headed by Chinese, and the influence of Chinese in the global semiconductor industry continues to increase.

5. Canalys: Mainland China’s PC market shipments will decline slightly in 2024 and will recover in the fourth quarter

A market report released by Canalys shows that due to weak demand in the commercial market, the annual shipments of mainland China's PC market in 2024 will fall by 4% year-on-year to 39.7 million units. However, the market has shown obvious signs of recovery in the fourth quarter, and industry prosperity has gradually recovered.It is worth adding that the tablet computer market in mainland China will perform well in 2024, with annual shipments increasing significantly by 11% to 31.5 million units, and is expected to maintain growth momentum in 2025. At the same time, AI PC shipments in mainland China will reach 5.8 million units in 2024, accounting for 15% of total PC shipments throughout the year, becoming a new growth highlight in the industry.

Judging from the market pattern throughout the year, the competitive landscape of leading brands is relatively stable: Lenovo ranks first with a shipment of 13.7 million units and a market share of 35%, continuing to lead the industry; Huawei ranks second with a shipment of 4.3 million units and a market share of 11%; iSoftStone and HP tie for third with a market share of 9%; Asus ranks fourth with a market share of 8%.

Broken down to the fourth quarter, benefiting from the 8% year-on-year surge in consumer demand, mainland China's PC market grew by 2% year-on-year and bottomed out. Notebook shipments increased by 6% to 8.6 million units, while desktop shipments fell by 9% to 2.9 million units.Among them, Lenovo still maintains the lead, with shipments of 4.1 million units, and a market share of 35%; iSoftStone performed well, with shipments of 1.2 million units, and its market share rose to 10%, with a year-on-year growth rate of 126%; Huawei shipped 1.1 million units, with a market share of 9%, surpassing HP and ranking third. The competitiveness of local brands continues to improve.Canalys predicts that driven by government subsidies and the replacement of domestic equipment, mainland China's PC market will resume growth in 2025, growing by 3% year-on-year to 41 million units, of which the proportion of AI PCs is expected to increase to 34%.

6. 恩智浦推出全新S32K5系列汽车MCU，内嵌MRAM解锁车规新场景

NXP (NXP) has officially launched the new S32K5 series of automotive MCUs. This is the automotive industry's first 16nm FinFET process MCU equipped with embedded magnetic RAM (MRAM). It further improves the product layout of NXP's CoreRide platform and helps realize a scalable software-defined vehicle (SDV) architecture to adapt to the development trend of automotive intelligence and electrification.

该系列MCU核心性能突出，搭载运行频率高达800 MHz的Arm Cortex CPU内核，依托16nm FinFET工艺实现高效节能的应用性能，同时配备专用的eIQ Neutron神经处理单元（NPU）——这是恩智浦自主研发的可扩展机器学习加速器，能够让机器学习算法在车辆边缘实现对传感器数据的节能、实时处理，适配汽车自动驾驶、智能座舱等场景的需求。据悉，MRAM凭借非易失性+高速+高耐久的优势，可在–40°C至150°C的宽温区间稳定工作，完美匹配车规级高可靠要求，解决了传统Flash在先进制程下难以集成、功耗偏高的瓶颈，为汽车频繁OTA更新、软件持续演进提供了有力支撑。

7. ON Semiconductor launches Hyperlux ID series depth sensors to empower industrial scenarios in multiple fields

ON Semiconductor recently announced the launch of the Hyperlux ID series, the first real-time indirect time-of-flight (iToF) sensor. This product features high-precision, long-distance measurement and three-dimensional imaging capabilities. It can efficiently adapt to the detection needs of fast-moving objects and fill ON Semiconductor's gap in the field of iToF sensors.ON Semiconductor has a strong presence in the field of imaging sensors and has previously launched a number of high-performance CMOS digital image sensors. The launch of the Hyperlux ID series has further improved its imaging and sensing product matrix.

The Hyperlux ID series adopts ON Semiconductor's new proprietary global shutter pixel architecture and comes with its own storage function, which can achieve real-time depth measurement while capturing the complete scene. The maximum depth sensing distance can reach 30 meters, which is 4 times that of the standard iToF sensor. It has a smaller size and is less difficult to integrate.This series of sensors can also generate black-and-white images and depth information at the same time, providing a comprehensive view of the environment without the need for separate vision and depth sensors, significantly reducing system integration costs.

In terms of product specifications, the Hyperlux ID series includes a 1.2-megapixel global shutter, 3.5µm back-illuminated pixel sensor, and offers two differentiated models: AF0130 has its own processing functions to simplify the integration process and reduce system costs; AF0131 supports customers to integrate their own depth detection algorithms to improve system flexibility.This series of products is widely used in multiple industrial scenarios such as automation and robotics, manufacturing and quality control, logistics and material handling, agricultural planting, and access control systems, helping to upgrade industrial intelligence.

8. 兆易创新推出GD25NE系列SPI NOR Flash，适配1.2V SoC应用场景

GigaDevice recently announced the launch of the new GD25NE series of SPI NOR Flash products. This series is specially designed for 1.2V SoC applications. It adopts a dual-voltage power supply design and can be seamlessly compatible with the next generation 1.2V SoC without the need for external boost circuits. This further strengthens GigaDevice’s market position in the field of dual-voltage power supply flash memory solutions and fills the gap in the low-voltage flash memory market.GigaDevice has been deeply involved in the field of flash memory for many years. It has previously launched SPI NOR Flash products with the smallest plastic package in the industry, and has accumulated profound technical advantages in the field of miniaturization and low-power flash memory.

With its higher performance and lower power consumption, the GD25NE series can fully meet the market's demand for advanced embedded storage solutions, and is especially suitable for application scenarios with high power consumption and volume requirements such as smart wearable devices, medical health, Internet of Things, data centers and edge artificial intelligence.In terms of product specifications, this series provides a variety of capacity options from 32Mb to 256Mb, and supports two packaging options: SOP16 (300 mil) and BGA24 (5×5 ball array), adapting to the design needs of different devices.Currently, the first product in this series, the 256Mb capacity GD25NE256H, has officially opened for sample supply, and the remaining products with capacities from 32Mb to 128Mb will be launched one after another to further enrich the product matrix.It is reported that GigaDevice's memory chip business revenue will increase by 26.41% year-on-year in 2025, becoming the company's main source of performance. The launch of the GD25NE series will further help it seize the low-voltage flash memory market share.