[Core Information] Samsung introduces Yangtze River storage patents, AMD sells server factories, and Loongson 3C6000 is about to be released

1. Samsung introduces Yangtze Memory patents to solve the problem of 400+ layers of flash memory stacking

• event: Samsung signed with Yangtze Memory3D NAND Hybrid Bonding Patent License, since10th Generation V10 NAND(Mass production in the second half of 2025) will use Yangtze StorageXtacking crystal stackTechnology.
• Technical background：
  • V10 target420–430 layer stacking, traditional bump connections lead to a sharp increase in pressure on the underlying circuit and a decrease in reliability.
  • W2W hybrid bonding: Two wafers are directly bonded,No bumps, shortened electrical paths, improve performance, heat dissipation and yield.
  • Yangtze River StorageFirst commercialized 4 years agoThe technology is completedGlobal patent layout。
• meaning：Global storage leader adopts Chinese storage patents on a large scale for the first time, marking the rapid development of domestic 3D NAND technologyPatent export。

2. Fudan Microelectronics: Overseas FPGA prices increase, domestic 1xnm FinFET products are shipped in small batches

• Overseas news: Xilinx, etc.Some overseas FPGA models increase in price。
• Domestic progress：
  • Based on1xnm FinFETNew generation FPGA, intelligent reconfigurable chipComplete sample testing and small batch sales。
  • The company is based onHigh reliability fieldMainly, it is less affected by overseas price fluctuations.
  • Product coverage5G, industry, satellite communications, AI acceleration, self-developed EDA tool chain.

3. Taiwan’s IC output value in 2024 will be 1.18 trillion yuan, with wafer foundry increasing by 30.1% (accounting for 61%)

• Whole:Taiwan IC Industry in 2024NT$5,315.1 billion (≈1.18 trillion yuan), year-on-year **+22.4%**.
• OEM (core engine)：NT$3,243.8 billion, year-on-year **+30.1%, accounting for the whole61.03%** (57.39% in 2023).
  • TSMC global market share67.1% (Q4), 64% for the whole year。
• design: NT$1,272.1 billion,+16.0%。
• Outlook: It is expected to be **+16.2%** in 2025, reaching NT$6.18 trillion.

4. AMD plans to sell ZT Systems server factory, valued at US$3-4 billion

• background: From August 2024$4.9 billionAcquired ZT Systems (AI server ODM).
• Current situation: Positive andCompal, Inventec, Pegatron, WistronWaiting for Asian manufacturers to negotiate the sale of manufacturing operations.
• Valuation：US$3-4 billion(including debt).
• time: earliest2025 Q2announced.
• strategy：Strip manufacturing, focus on chip design + AI system solutions, to avoid competing with customers such as Dell and HPE.
• Follow-up: Confirmed in May 2025$3 billionsell toSanmina(US EMS).

5. National Core Technology: Car-grade security chip CCM4202S shippedBreaking one million

• Products：CCM4202S(32-bit Cortex‑M4F)Suzhou Guoxin Technology Co., Ltd.。
• Certification：AEC‑Q100, EAL5+, National Class II。
• Application：Smart cockpit, OTA, V2X, ADASSuzhou Guoxin Technology Co., Ltd.。
• progress：Bulk supply of over one million pieces, entering the leading car companies.
• Positioning: Vehicle-mounted **Security Brain**, supporting national secret/international algorithms and multi-dimensional attack protection.

6. Loongson Zhongke: Launched in 20253C6000 server CPU(16-core, autonomous dragon architecture)

• Positioning: new generationDomestic server CPU, replacing 3C5000.
• Architecture：LoongArch dragon architecture、16 cores 32 threads (single silicon)。
• Expand：
  • 3C6000/D:Double silicon wafer32 cores 64 threads。
  • 3C6000/Q: Four silicon wafers64 cores 128 threads。
• Performance: 16 cores compared to Xeon Silver 4314; 64 corestranscendXeon Platinum 8380.
• safe:getThe highest level of safety and reliability: Level IICertification.
• market: Breakthrough firststorage serverand other subdivided scenes.

7. Sanan/ST Chongqing 8-inch SiC project is put into operation and Silan Micro SiC production line is capped

• San'an + Yifa (Anyifa)：
  • Chongqing 8 inchesAutomotive Grade SiCproduction lineOfficially opened。
  • Mass production in Q4 of 2025,Planned annual output of 480,000 pieces。
  • investment23 billion yuan, Sanan holds 51% of the shares.
• Shilanwei (Xiamen)：
  • 8-inch SiC power device production line (Phase I)Comprehensive capping。
  • targetThe line will be put through the end of 2025 and put into production in Q1 of 2026.。
  • 2028Annual output: 420,000 pieces, forNew energy vehicles, photovoltaics, AI server power supply。

8. Micron G9 UFS 4.1/3.1 shipped, Intel 18A tested by Broadcom/NVIDIA

• Micron：
  • The world's firstG9 process UFS 4.1/3.1Mobile phone storageStart shipping。
  • Capacity256GB–1TB, supportlocal AI, folding screen.
• Intel OEM：
  • Broadcom, NvidiaEvaluation has started18A process。
  • AMDAlso testing 18A.
  • Marking the advanced manufacturing process of x86 giantReturn to customer perspective。

Summary of core trends this week

1. Independent technological breakthrough:Yangtze Memory, Loongson, and National Core Technology are inStorage, CPU, car safetyDomain implementationInternational level breakthrough。
2. industrial structure adjustment：AMDAsset-light, IDM (Microchip / ON Semiconductor / Infineon)Layoffs / selling factory, focusing on high gross profit.
3. Power semiconductor explosion：8-inch SiCIntensive implementation of production capacity supportsNew energy vehicles + AI power supplyDouble main line.
4. AI driven computing power: Driven by the demand for computing power on the client side/data centerStorage, advanced process, server ODMHigh prosperity.