[Core News] Samsung upgrades Xi’an flash memory factory, GlobalFoundries revenue declines, SiC and AI hardware continue to be booming

1. Samsung Xi’an flash memory factory upgrade: 286-layer NAND production line to be launched within the year

• The Xi'an factory currently has136 layers (V6)Upgrade to238 layers (V8)
• planwithin 2025Import **9th generation 286-layer (V9)** production line
• New equipment enters the market in the first half of the year, with target monthly production capacity by the end of the year2,000～5,000 pieces
• Samsung V9 NAND has been mass produced in Pyeongtaek, South Korea P4; next generation400+ layers V10Will be released at ISSCC 2025

2. Samsung Pyeongtaek OEM production line resumes production, Chinese orders drive full production

• Previous 4/5/7nm production capacityAbout 50% shutdown, the shutdown has now been cancelled.
• planFull production from June 2025
• Driving factors: Exynos AP orders rebound,Chinese mining machine chip ordersIncrease and strong demand for HBM4 supporting logic chips

3. Academy of Information and Communications Technology: Domestic mobile phone shipments in 2024 will reach 314 million units, +8.7% year-on-year

• All year round:314 million units(+8.7%); 5G mobile phones272 million units(+13.4%), accounting for 86.4%
• Domestic brands:269 million units(+16.3%), accounting for 85.6%
• December single month:34.53 million units(+22.1%), the recovery trend is obvious

4. GlobalFoundries 2024 full-year revenue - 9%, wafer shipments - 4%

• full year revenue$6.75 billion(-9%), operating losses$214 million
• Wafer shipments throughout the year2.124 million pieces（-4%）
• Q4 revenue$1.83 billion(-1% year-on-year, +5% month-on-month), shipments595,000 12-inch equivalents（+8%）

5. Ming-Chi Kuo: NVIDIA RTX 50 series chips are in tight supply

• RTX 5090/5080 hasOut of stock
• RTX 5070/5060 mass production may be postponed toMarch, April
• Even if mass production is scheduled,Scarce supply, will still face shortages as soon as they go on sale

6. Infineon expands 650V CoolSiC MOSFET G2 product line

• NewQ-DPAK、TOLLPackage version
• On-resistance: TOLL10～60mΩ；Q-DPAK 7/10/15/20mΩ
• Targeted at:AI server power supply, charging pile, energy storage, electric vehicle, humanoid robot, industrial driveWait
• Advantages: smaller size, stronger heat dissipation, lower system cost

Summary of core trends

• storage:NAND to238/286 floorsRapid iteration, Samsung China's production capacity is simultaneously upgraded, and the industry is expected to pick up in the second half of the year
• OEM: GlobalFoundries is under pressure, Samsung OEM relies onSpecial chip orderResume production
• terminal: The mobile phone market recovers, and the share of domestic products continues to increase.
• Power semiconductor：SiC MOSFET continues to expand its products,AI servers, new energy, robotscore increment
• AI hardware: The supply of graphics card chips is tight, which confirms the strong demand.