Infineon and TI join Nvidia's supply chain, opening up the AI power supply market with hard power

1. The supply chain landscape is rewritten, and the two giants enter the AI server market

2. Infineon: Silicon + SiC + GaN trinity, anchoring high-power solutions for data centers

1. Complete AI power routing

   Lay out a full range of server PSUs of 3kW, 3.3kW, 8kW, and 12kW; the 8kW solution can support AI racks of more than 300kW, and the power density has jumped significantly, from 32W/in³ to100W/in³, significantly reducing space, cooling and operation and maintenance costs.
2. Deep integration of wide bandgap materials

   FusionSilicon MOS, SiC silicon carbide, GaN gallium nitrideThe three types of devices are collaboratively designed, and the overall machine efficiency can reach 97.5%; relying on mature product matrices such as CoolSiC, CoolGaN, and OptiMOS, it is suitable for high-voltage and high-frequency AI power supply scenarios.
3. Construction of industrial chain barriers

• Acquired GaN Systems to complement gallium nitride core technology;
• landing8-inch 300mm GaNMass production technology to reduce costs and increase production;
• Deepen the long-term cooperation with Wolfspeed SiC materials, superimpose Cold Split cutting technology, and improve the utilization rate of silicon carbide materials;
• Continue to iterate on 650V/1200V SiC MOS, 700V GaN transistors, and high-voltage silicon-based power devices.

3. Texas Instruments TI: GaN iteration + advanced packaging to strengthen the advantages of high-density power supply

1. Focus on mass production of GaN technology

   We have been deeply involved in gallium nitride power devices for a long time and accelerated the upgrade of GaN production line from 6-inch to8 inches, large-scale cost reduction; launched the integrated GaN power IPM module DRV7308, with a driving efficiency of 99% and a 55% reduction in equipment size.
2. MagPack innovative packaging technology

   The self-developed high-density power supply package reduces the module size by 50% and doubles the power density. It simultaneously optimizes EMI electromagnetic interference and improves conversion efficiency, perfectly adapting to the narrow space and complex electromagnetic environment of the AI server.
3. Analog power long-term barriers

   With profound technical accumulation in the fields of power management, voltage conversion, and digital isolation, it can provide a complete set of stable and streamlined AI server power control solutions to lower customer design thresholds.

4. Industry competition escalates, and third-generation semiconductors become a core watershed

5. Industry Summary